Characterization of the AZ31/AW-6060 joint fabricated using compound casting with a Zn interlayer at relatively low temperature conditions

T. Bucki, M. Konieczny, D. Bolibruchová, S. Rzepa
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引用次数: 1

Abstract

The work deals with the fabrication of a joint between AZ31 magnesium alloy and AW-6060 aluminium alloy with the use of a Zn interlayer. The Zn layer was produced on the surface of an AW-6060 alloy insert by diffusion bonding. The insert was then placed inside a steel mould and kept at room temperature. The joint was produced using compound casting by filling the mould with liquid AZ31 alloy, heated to 650 °C. The microstructure of the bonding zone formed between joined alloys was analysed using an optical microscope and a scanning electron microscope equipped with an energy dispersive X-ray spectroscope. The properties of the joint were examined using Vickers microhardness measurements and simple shear strength testing. As a result of the experiment, the 400 [micro]m thick bonding zone with a complex microstructure was formed between the alloys. The microstructural analysis showed that the bonding zone reveals a high concentration of Zn and Mg. The layers of a eutectoid (a MgZn phase + a solid solution of Al and Zn in Mg), a Mg5Al2Zn2 phase and a Mg(Al,Zn)2 phase with fine particles of other phases were observed there. The bonding zone was characterized by relatively high microhardness, which was related to the brittleness of the constituents. The shear strength of the examined joint was 19.6 +/- 2.5 MPa.
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低温条件下Zn中间层复合铸造AZ31/AW-6060接头的表征
采用Zn中间层制备AZ31镁合金与AW-6060铝合金的接头。采用扩散键合的方法在AW-6060合金镶件表面形成Zn层。然后将插入物放入钢模具中并在室温下保存。用AZ31合金液体填充模具,加热至650℃,采用复合铸造工艺生产接头。采用光学显微镜和带能量色散x射线能谱仪的扫描电镜对连接合金间形成的结合区进行了显微组织分析。采用维氏显微硬度测试和简单抗剪强度测试对接头性能进行了检测。实验结果表明,合金间形成了400[微]m厚、组织复杂的结合区。显微组织分析表明,结合区含有高浓度的Zn和Mg。形成了MgZn相+ Al和Zn在Mg中的固溶体的共析层、Mg5Al2Zn2相和Mg(Al,Zn)2相及其他相的细颗粒层。结合区具有较高的显微硬度,这与组分的脆性有关。接头抗剪强度为19.6 +/- 2.5 MPa。
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