Potential hazards associated with photocuring dentin bonding agents

N. Thompson, A. Puckett, S. Phillips, G. Reeves
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Abstract

Summary form only received as follows: Light sources used to cure dental restorative materials have improved greatly with many of them having intensities approaching 800 mW/cm/sup 2/. Because of the increased light intensity, the potential for exposing pulpal tissues to elevated temperatures is greater. The objective of this study was to measure the temperature rise associated with curing a dentin adhesive ProBond (Caulk Dentsply, Milford, DE) and a composite Z-100 (3M, St. Paul, MN) using an Optilux Model 401 light curing unit (Demetron Research Corp., Danbury, CT). The experimental set up consisted of a stainless steel mold having a diameter of 6 mm x 3 mm depth placed over a mylar strip and a type J thermocouple. The assembly was held at 37/spl deg/C. Three sets of measurements were taken in triplicate for the conditions: A) no material; B) bonding agent; C) bonding agent + 2 mm composite. Temperatures were recorded after exposure to the light for 10, 20, 30 and 40 seconds and are given in a table. The temperature increase was significant for each group. The largest temperature increase was 42.5/spl deg/C when no material was present. Placement of the bonding agent gave a maximum temperature increase of 31.6/spl deg/C while curing of the composite gave only a 9.5/spl deg/C increase due to its ability to act as an insulator. These results suggest that curing of bonding agents in deep restorations may expose the dentin surface to significant temperature increases even though the light source may be 3 mm from the exposed surface.
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光固化牙本质粘接剂的潜在危害
仅收到的摘要如下:用于修复牙齿修复材料的光源有了很大的改进,其中许多光源的强度接近800 mW/cm/sup /。由于光照强度的增加,使牙髓组织暴露在高温下的可能性更大。本研究的目的是测量牙本质粘合剂ProBond (Caulk Dentsply, Milford, DE)和复合材料Z-100 (3M, St. Paul, MN)使用Optilux Model 401光固化装置(Demetron Research Corp., Danbury, CT)固化时的温升。实验装置由一个直径为6毫米x 3毫米的不锈钢模具和一个J型热电偶组成。大会在摄氏37度的温度下举行。在以下条件下进行三组测量:A)无材料;B)粘结剂;C)粘结剂+ 2mm复合材料。在光下暴露10、20、30和40秒后记录温度,并以表格形式给出。各组体温升高均显著。无材料存在时,升温幅度最大,为42.5℃/spl℃。结合剂的放置使复合材料的温度最高升高了31.6/spl℃,而由于其作为绝缘体的能力,固化后的复合材料的温度仅升高了9.5/spl℃。这些结果表明,在深度修复体中,即使光源可能距离暴露表面3mm,固结剂的固化也会使牙本质表面暴露于显著的温度升高。
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