New criteria for the RDF induced drain current variation considering strain and transport effects in strain-silicon CMOS devices

E. Hsieh, S. Chung, J.C. Wang, C. S. Lai, C. Tsai, R. Huang, C. Tsai, C. Liang
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Abstract

In this paper, we have studied the Id variation in linear and saturation region by considering the strain-induced effect and the carrier transport of strained CMOS devices. It was found that the origin of linear Id variation comes from the mobility scattering; while in saturation region, the Id variation is dominated by the injection velocity. The higher the injection velocity is, the smaller the saturation Id variation becomes. These results provide us a guideline for achieving good variability control of strain-based CMOS technologies.
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考虑应变和输运效应的应变硅CMOS器件中RDF诱发漏极电流变化的新准则
本文通过考虑应变效应和载流子输运,研究了CMOS器件在线性区和饱和区的Id变化。发现线性Id变化的来源是迁移率散射;而在饱和区,流速的变化主要受注入速度的影响。注入速度越高,饱和度变化越小。这些结果为我们实现基于应变的CMOS技术的良好可变性控制提供了指导。
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