{"title":"Thermoelectric properties and structures of the sintered compact of Cu:Sn:S = 8:1:4 composition","authors":"M. Hasaka, T. Morimura, T. Aki, S. Kondo","doi":"10.1109/ICT.1996.553282","DOIUrl":null,"url":null,"abstract":"The compact of Cu:Sn:S=8:1:4 composition was prepared by sintering. The thermoelectric properties of the compact were measured as a function of temperature and annealing period. The microstructures were investigated by X-ray diffraction experiments and transmission electron microscopic observation. The compact is desirable in thermoelectric properties and thermal stability below 450 K. The compact consists of mixtures of several compound structures.","PeriodicalId":447328,"journal":{"name":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1996-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICT.1996.553282","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The compact of Cu:Sn:S=8:1:4 composition was prepared by sintering. The thermoelectric properties of the compact were measured as a function of temperature and annealing period. The microstructures were investigated by X-ray diffraction experiments and transmission electron microscopic observation. The compact is desirable in thermoelectric properties and thermal stability below 450 K. The compact consists of mixtures of several compound structures.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
