Project management for system-on-chip using multi-chip modules

D. Dent
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引用次数: 2

Abstract

Multi-Chip Module (MCM) projects are complex, in terms of the technology used, and are expensive, typically in excess of $50,000. MCM technology is very unforgiving in that mistakes cannot be easily rectified or the device easily re-worked. The Mosaic Earth Sensor Mutli-Chip Module (MESMCM) project, which was the subject of a case study, was a high speed, first-of-a-kind development that ran into some difficulties in spite of rigorous project management. It is intended to compare the project management structure used for a technology demonstrator with the new structure used on subsequent MCM designs. One of the outcomes of this case study was that the management of an MCM project is just as crucial as the technical aspects and resulted in several guidelines about the nature and composition of the design team. The lessons learned from the MESMCM project were applied very effectively to further MCM designs.
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使用多芯片模块的片上系统项目管理
就所使用的技术而言,多芯片模块(MCM)项目非常复杂,而且价格昂贵,通常超过5万美元。MCM技术是非常不可原谅的,因为错误不容易纠正,设备也不容易重新加工。马赛克地球传感器多芯片模块(MESMCM)项目是一个案例研究的主题,它是一个高速的、首创的开发项目,尽管有严格的项目管理,但还是遇到了一些困难。它旨在比较用于技术演示的项目管理结构与随后MCM设计中使用的新结构。这个案例研究的结果之一是,MCM项目的管理与技术方面一样重要,并产生了一些关于设计团队的性质和组成的指导方针。从MESMCM项目中吸取的经验教训非常有效地应用于进一步的MCM设计。
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