Polarity dependence of the conduction mechanism in inter-level low-k dielectrics

M. Lin, J. Liang, C. J. Wang, A. Juan, K. Su
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引用次数: 2

Abstract

Leakage currents of inter level carbon-doped silicon oxide low-k dielectric in copper interconnect structure are investigated over the electric field range of zero to the breakdown field at different temperatures. A remarkable bias polarity dependence of conduction current and breakdown voltage is observed in such structure. Different conduction mechanisms are found in different electric field ranges. Ohmic conduction of electron hopping dominates at the low electric field. Poole-Frenkel emission and Fowler-Nordheim tunneling occur at high field on the different bias conditions respectively. The activation energy or energy barrier belong to each conduction mechanism was estimated. These conduction phenomena were explained by the asymmetry energy band diagram and surface defects. The bias polarity dependence of breakdown voltage indicates the breakdown mechanism of inter level low-k dielectric is attribute to carrier current but not electric field as ascribed by E-model.
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低k介电体间传导机制的极性依赖性
研究了不同温度下,在零至击穿电场范围内,铜互连结构中掺杂碳氧化物硅低k介电介质的漏电流。在这种结构中观察到导电电流和击穿电压显著的偏置极性依赖性。在不同的电场范围内发现不同的传导机制。在低电场下,电子跳变的欧姆传导占主导地位。在不同偏压条件下,高场下分别发生了普尔-弗兰克尔发射和福勒-诺德海姆隧穿。估计了各传导机制的活化能或能垒。用不对称能带图和表面缺陷解释了这些传导现象。击穿电压的偏置极性依赖性表明,低k介电介质的击穿机制是由载流子电流引起的,而不是e模型所认为的电场引起的。
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