Effect of interlayer material on the spreading performance and microstructure of diffusion brazd IC10 superalloy

Qi Li, Ming Xiong, Fengmei Liu, X. Yue, Likun Li, Haitao Gao, Y. Yi
{"title":"Effect of interlayer material on the spreading performance and microstructure of diffusion brazd IC10 superalloy","authors":"Qi Li, Ming Xiong, Fengmei Liu, X. Yue, Likun Li, Haitao Gao, Y. Yi","doi":"10.1109/ICEDME50972.2020.00120","DOIUrl":null,"url":null,"abstract":"The diffusion brazd test of IC10 superalloy was carried out by using Russia solder M4 interlayer powder. The wetting quality of the high-temperature alloy was evaluated by the contact angle of wetting at various temperatures. The result shows that at the temperature of 1250°C, the contact angles of interlayer powder M4 alloy do not exceed 10°, it has high wettability and spreadability over the surface of the IC10 alloy. The structure of the joints has a smooth transition from the base metal to the soldered joint when the interlayer powder M4 was used. In the structure of the joint, the base metal contains a large number of Ɣ '- phases. The microstructure of the weld metal does not have continuous eutectic layers, but includes carbide carboride and other phases when the interlayer powder M4 was used.","PeriodicalId":155375,"journal":{"name":"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEDME50972.2020.00120","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The diffusion brazd test of IC10 superalloy was carried out by using Russia solder M4 interlayer powder. The wetting quality of the high-temperature alloy was evaluated by the contact angle of wetting at various temperatures. The result shows that at the temperature of 1250°C, the contact angles of interlayer powder M4 alloy do not exceed 10°, it has high wettability and spreadability over the surface of the IC10 alloy. The structure of the joints has a smooth transition from the base metal to the soldered joint when the interlayer powder M4 was used. In the structure of the joint, the base metal contains a large number of Ɣ '- phases. The microstructure of the weld metal does not have continuous eutectic layers, but includes carbide carboride and other phases when the interlayer powder M4 was used.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
层间材料对扩散钎焊IC10高温合金扩散性能和显微组织的影响
采用俄罗斯焊料M4层间粉对IC10高温合金进行了扩散钎焊试验。通过不同温度下的润湿接触角来评价高温合金的润湿质量。结果表明:在1250℃温度下,层间粉末M4合金的接触角不超过10°,在IC10合金表面具有较高的润湿性和铺展性。使用层间粉末M4时,接头的组织从母材到焊点的过渡平滑。在接头组织中,母材含有大量的Ɣ′相。使用层间粉末M4时,焊缝金属的显微组织不存在连续的共晶层,而是包含碳化物和其他相。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Labeled free Malachite Green immunosensor based on chitosan and gold nano particles Design of Intelligent Unlocking System in Computer Room Based on Embedded Technology Investigation on automatic control system of cyclic pressure test for curtain wall Air Material Demand Forecast Based on Combined Neural Network Preparation and performance of polypropylene based building template pellicle
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1