Thermal design considerations for the advanced mezzanine card form factor

Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005. Pub Date : 2005-03-15 DOI:10.1109/STHERM.2005.1412192

J. Leija, W. Wei

{"title":"Thermal design considerations for the advanced mezzanine card form factor","authors":"J. Leija, W. Wei","doi":"10.1109/STHERM.2005.1412192","DOIUrl":null,"url":null,"abstract":"This paper presents the: requirements necessary to create an adequate thermal design for an advanced mezzanine card. The cooling limits of an AdvancedMC platform in an AdvancedTCA/spl reg/ chassis are determined based on the principles of mass and energy conservation. This article also provides recommendations to optimize the AdvancedMC platform for maximum heat dissipation. In addition, it includes a case study on methods to cool the processor advanced mezzanine card. (PrAMC) utilizing typical single board computer components. Finally, practical cooling limitations are established for microprocessors in the PrAMC form factor. The method presented can be used to determine practical cooling limitations for all other critical components on the platform. It is recommended that AdvancedMC designers use these techniques to determine the cooling limitations for AdvancedMC platform designs. The intent of this document is to instill an understanding that the cooling capacity for AdvancedMC platforms is limited due to system boundary conditions, component limitations, and physics.","PeriodicalId":256936,"journal":{"name":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2005.1412192","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

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Abstract

This paper presents the: requirements necessary to create an adequate thermal design for an advanced mezzanine card. The cooling limits of an AdvancedMC platform in an AdvancedTCA/spl reg/ chassis are determined based on the principles of mass and energy conservation. This article also provides recommendations to optimize the AdvancedMC platform for maximum heat dissipation. In addition, it includes a case study on methods to cool the processor advanced mezzanine card. (PrAMC) utilizing typical single board computer components. Finally, practical cooling limitations are established for microprocessors in the PrAMC form factor. The method presented can be used to determine practical cooling limitations for all other critical components on the platform. It is recommended that AdvancedMC designers use these techniques to determine the cooling limitations for AdvancedMC platform designs. The intent of this document is to instill an understanding that the cooling capacity for AdvancedMC platforms is limited due to system boundary conditions, component limitations, and physics.

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高级夹层卡外形因素的热设计考虑

本文介绍了为高级mezz扣卡创建适当的热设计所需的要求。AdvancedMC平台在AdvancedTCA/spl reg/机箱中的散热极限是根据质量和能量守恒原则确定的。本文还提供了优化AdvancedMC平台以获得最大散热的建议。此外，还包括对高级mezz卡处理器冷却方法的案例研究。(PrAMC)利用典型的单板计算机组件。最后，为PrAMC形式的微处理器建立了实际的冷却限制。所提出的方法可用于确定平台上所有其他关键部件的实际冷却限制。建议AdvancedMC设计人员使用这些技术来确定AdvancedMC平台设计的冷却限制。本文档的目的是灌输一种理解，即由于系统边界条件，组件限制和物理，AdvancedMC平台的冷却能力是有限的。

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Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005.

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