Steady state heat transfer analysis of aluminium microprocessors

Y. Joshi, D. Ikhar
{"title":"Steady state heat transfer analysis of aluminium microprocessors","authors":"Y. Joshi, D. Ikhar","doi":"10.1109/I2CT.2017.8226232","DOIUrl":null,"url":null,"abstract":"The advanced process and higher profile works rapidly increasing the load on microprocessor and heat evolving per unit area. The paper involves the steady state heat transfer analysis of aluminium heat sink and the graphite metal heat sink. Both heat sink has put under the same physical condition and temperature profile. Modeling and Analysis has carried out by using the steady state heat transfer (SSHT) based software, ANSYS. Obtained results has been compared to determine and proving the best heat sink among them. Result has gotten by analytical and software with manual calculation. Optimization for the both heat sink has done to find out suitable heat sink with such microprocessor.","PeriodicalId":343232,"journal":{"name":"2017 2nd International Conference for Convergence in Technology (I2CT)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 2nd International Conference for Convergence in Technology (I2CT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/I2CT.2017.8226232","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The advanced process and higher profile works rapidly increasing the load on microprocessor and heat evolving per unit area. The paper involves the steady state heat transfer analysis of aluminium heat sink and the graphite metal heat sink. Both heat sink has put under the same physical condition and temperature profile. Modeling and Analysis has carried out by using the steady state heat transfer (SSHT) based software, ANSYS. Obtained results has been compared to determine and proving the best heat sink among them. Result has gotten by analytical and software with manual calculation. Optimization for the both heat sink has done to find out suitable heat sink with such microprocessor.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
铝微处理器稳态传热分析
先进的工艺和更高的外形迅速增加了微处理器的负荷和单位面积的发热量。本文对铝散热器和石墨金属散热器进行了稳态传热分析。两个散热器都置于相同的物理条件和温度分布下。利用基于稳态传热(SSHT)的ANSYS软件进行了建模和分析。对所得结果进行了比较,确定并证明了其中最佳的散热片。通过分析和软件手工计算得到了结果。对两种散热器进行了优化,找到了适合该微处理器的散热器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Face detection based ATM security system using embedded Linux platform Implementation of news app based on cordova cross-platform Design topology based comparative study on electric and photometric parameters of commercially available led lamp systems Design and formal analysis of electronic voting protocol using AVISPA Tele-operated trajectory tracking of differential drive wheeled mobile robot using haptic robot
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1