Miniaturising of K-Band Coplanar MMIC-Amplifiers by Using Lumped Elements

Y. Kalayci, R. Tempel, B. Hopf, J. Borkes, R. Grundler, I. Wolff
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引用次数: 3

Abstract

As MMICs become more widespread in commercial applications the costs of production gain increased attention. For the MMIC-Designer it is important to reduce the chip size, while keeping the electrical characteristics. To demonstrate which size reduction is possible using lumped elements, this paper documents the comparison of a distributed and a lumped element MMIC K-band amplifier in coplanar line technique. The distributed element amplifier is a two-stage design and needs a size of 3 mm2. In the frequency range from 18 to 20 GHz the gain is more than 12 dB. The lumped element amplifier is a three-stage design, which has a size of 1 mm2. For the same frequency range the gain is more than 23 dB.
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集总元件在k波段共面mmic放大器小型化中的应用
随着mmic在商业应用中的广泛应用,其生产成本受到越来越多的关注。对于MMIC-Designer来说,在保持电气特性的同时减小芯片尺寸非常重要。为了证明使用集总元件可以减小尺寸,本文记录了共面线技术中分布式和集总元件MMIC k波段放大器的比较。分布式元件放大器是两级设计,需要的尺寸为3 mm2。在18 ~ 20ghz频率范围内,增益大于12db。集总元件放大器是三级设计,其尺寸为1 mm2。在相同的频率范围内,增益大于23 dB。
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