I. E. Masri, T. Le Gouguec, P. Martin, R. Allanic, C. Quendo
{"title":"Integrated dipole antennas and propagation channel on silicon in Ka band for WiNoC applications","authors":"I. E. Masri, T. Le Gouguec, P. Martin, R. Allanic, C. Quendo","doi":"10.1109/SAPIW.2018.8401659","DOIUrl":null,"url":null,"abstract":"This paper presents an implementation of the transmission channel for tireless interconnect Network-on-Chip (WiNoC) applications in the context of BBC (on-chip wireless Broadcast-Based parallel Computing) project. First, the advantages of the WiNoC for intra-chip communications and particularly our application are presented. Then, the intra-chip transmission is discussed and analyzed using integrated dipole antennas in Ka band (26–40 GHz). The simulations are compared to the measurements on two manufactured demonstrators. They show a good agreement and validate the problems encountered due to the Silicon substrate and its environment. Finally, we propose perspective solutions in order to improve the intra-chip transmission on integrated circuits.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SAPIW.2018.8401659","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13
Abstract
This paper presents an implementation of the transmission channel for tireless interconnect Network-on-Chip (WiNoC) applications in the context of BBC (on-chip wireless Broadcast-Based parallel Computing) project. First, the advantages of the WiNoC for intra-chip communications and particularly our application are presented. Then, the intra-chip transmission is discussed and analyzed using integrated dipole antennas in Ka band (26–40 GHz). The simulations are compared to the measurements on two manufactured demonstrators. They show a good agreement and validate the problems encountered due to the Silicon substrate and its environment. Finally, we propose perspective solutions in order to improve the intra-chip transmission on integrated circuits.