Pub Date : 2018-06-29DOI: 10.1109/SAPIW.2018.8401643
Xiao Ma, M. Raginsky, A. Cangellaris
This paper proposes the use of Variational Autoencoders, a generative modeling technique, for the problem of inferring S-parameters of linear multiport networks in the presence of manufacturing variability. The Variational Autoencoder learns the underlying data generation process and yields a generative network that can approximately mimic the probability distribution of the training data. The generated samples can be used for subsequent statistical simulations. A post-processing step, applying Vector Fitting to the predicted S-parameters, constrains the model to a finite-order rational function form and enforces appropriate physical constraints. The method is validated through its application to a coupled micro strip transmission line.
{"title":"A machine learning methodology for inferring network S-parameters in the presence of variability","authors":"Xiao Ma, M. Raginsky, A. Cangellaris","doi":"10.1109/SAPIW.2018.8401643","DOIUrl":"https://doi.org/10.1109/SAPIW.2018.8401643","url":null,"abstract":"This paper proposes the use of Variational Autoencoders, a generative modeling technique, for the problem of inferring S-parameters of linear multiport networks in the presence of manufacturing variability. The Variational Autoencoder learns the underlying data generation process and yields a generative network that can approximately mimic the probability distribution of the training data. The generated samples can be used for subsequent statistical simulations. A post-processing step, applying Vector Fitting to the predicted S-parameters, constrains the model to a finite-order rational function form and enforces appropriate physical constraints. The method is validated through its application to a coupled micro strip transmission line.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127704934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-06-29DOI: 10.1109/SAPIW.2018.8401676
J. Schutt-Ainé
This paper explores the circuit synthesis of blackbox macromodels through the use of distributed networks. A lossless transmission-line representation is obtained from the scattering parameter response. The method offers the advantage of generating physical, and nonnegative circuit elements and is relatively easy to implement. The circuit extraction algorithms is studied and tested through the use of simulation to verify the robustness and accuracy of the technique.
{"title":"Circuit synthesis of blackbox macromodels from S-parameter representation","authors":"J. Schutt-Ainé","doi":"10.1109/SAPIW.2018.8401676","DOIUrl":"https://doi.org/10.1109/SAPIW.2018.8401676","url":null,"abstract":"This paper explores the circuit synthesis of blackbox macromodels through the use of distributed networks. A lossless transmission-line representation is obtained from the scattering parameter response. The method offers the advantage of generating physical, and nonnegative circuit elements and is relatively easy to implement. The circuit extraction algorithms is studied and tested through the use of simulation to verify the robustness and accuracy of the technique.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-06-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124541803","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-05-22DOI: 10.1109/SAPIW.2018.8401671
F. Distler, J. Schür, M. Vossiek
High precision cables for millimeter wave (mmW) applications are very expensive and are not suitable for long distance transmissions due to their high insertion loss. However the demand for high performance cables at mmW frequencies will increase due to constantly growing requirements for different applications such as radar, mmW imaging or high speed communication. Because of their outstanding transmission behaviour at low costs dielectric waveguides (DWG) are capable of replacing coaxial transmission lines in many fields by now. Thus this paper presents an in-depth metrological characterization of dielectric waveguides for mmW transmission line applications. Thereby the focus is on typical transmission line charactersistics: return loss, insertion loss, bending angle, bending radius, reproducibility and interference resistance with regard to magnitude and phase stability to provide direct comparability with other high precision transmission line techniques.
{"title":"In-depth characterization of a dielectric waveguide for mmW transmission line applications","authors":"F. Distler, J. Schür, M. Vossiek","doi":"10.1109/SAPIW.2018.8401671","DOIUrl":"https://doi.org/10.1109/SAPIW.2018.8401671","url":null,"abstract":"High precision cables for millimeter wave (mmW) applications are very expensive and are not suitable for long distance transmissions due to their high insertion loss. However the demand for high performance cables at mmW frequencies will increase due to constantly growing requirements for different applications such as radar, mmW imaging or high speed communication. Because of their outstanding transmission behaviour at low costs dielectric waveguides (DWG) are capable of replacing coaxial transmission lines in many fields by now. Thus this paper presents an in-depth metrological characterization of dielectric waveguides for mmW transmission line applications. Thereby the focus is on typical transmission line charactersistics: return loss, insertion loss, bending angle, bending radius, reproducibility and interference resistance with regard to magnitude and phase stability to provide direct comparability with other high precision transmission line techniques.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126640967","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-05-22DOI: 10.1109/SAPIW.2018.8401650
G. Méndez-Jerónimo, R. Torres‐Torres
This paper presents a methodology to assess the performance of edge-coupled transmission lines when interconnecting imperfectly matched circuit stages. The methodology considers common and differential mode signal propagation, and allows for the prediction of reflection and transmission of signals as if the channel is already operating within a practical circuit. This is achieved by means of a procedure involving embedding and de-embedding impedances to S-parameter data to allow for the straightforward transformation to mixed-mode S-parameters using the desired impedance terminations. The application of the proposal is shown even for the case where the output impedances (i.e., common and differential) of the driver differ from the input impedances of the receiver.
{"title":"Assessment of coupled transmission lines embedded between imperfectly matched differential circuit stages","authors":"G. Méndez-Jerónimo, R. Torres‐Torres","doi":"10.1109/SAPIW.2018.8401650","DOIUrl":"https://doi.org/10.1109/SAPIW.2018.8401650","url":null,"abstract":"This paper presents a methodology to assess the performance of edge-coupled transmission lines when interconnecting imperfectly matched circuit stages. The methodology considers common and differential mode signal propagation, and allows for the prediction of reflection and transmission of signals as if the channel is already operating within a practical circuit. This is achieved by means of a procedure involving embedding and de-embedding impedances to S-parameter data to allow for the straightforward transformation to mixed-mode S-parameters using the desired impedance terminations. The application of the proposal is shown even for the case where the output impedances (i.e., common and differential) of the driver differ from the input impedances of the receiver.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"757 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132896428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-05-22DOI: 10.1109/SAPIW.2018.8401663
P. Bantavis, M. Le Roy, A. Pérennec, R. Lababidi, D. Le jeune
This work presents a new design approach of wideband multilayer Electromagnetic Band Gaps (EBGs) suitable for both on package antenna isolation and switching noise suppression in high speed digital circuits. Depending on the target applications, the design principle is implemented from two conventional types of EBGs in order to improve their initial performance. By stacking multiple dielectric layers with integrated vias in both types of EBGs, it's possible to achieve dual band performance, to enhance the relative bandwidth of the first band gap and to miniaturize the unit cell. The dispersion diagrams of the multilayer EBGs are proposed and full-wave simulations are performed to validate the antenna isolation and noise suppression bandwidths of the final structures.
{"title":"Miniaturized wide- and dual-band multilayer electromagnetic bandgap for antenna isolation and on-package/PCB noise suppression","authors":"P. Bantavis, M. Le Roy, A. Pérennec, R. Lababidi, D. Le jeune","doi":"10.1109/SAPIW.2018.8401663","DOIUrl":"https://doi.org/10.1109/SAPIW.2018.8401663","url":null,"abstract":"This work presents a new design approach of wideband multilayer Electromagnetic Band Gaps (EBGs) suitable for both on package antenna isolation and switching noise suppression in high speed digital circuits. Depending on the target applications, the design principle is implemented from two conventional types of EBGs in order to improve their initial performance. By stacking multiple dielectric layers with integrated vias in both types of EBGs, it's possible to achieve dual band performance, to enhance the relative bandwidth of the first band gap and to miniaturize the unit cell. The dispersion diagrams of the multilayer EBGs are proposed and full-wave simulations are performed to validate the antenna isolation and noise suppression bandwidths of the final structures.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124916362","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-05-22DOI: 10.1109/SAPIW.2018.8401661
Jan-Philipp Roth, Thomas Kühler, E. Griese
Integrated optical interconnect systems are getting higher attention due to continuously increasing data rates in computer systems. For the realization of these systems, optical waveguide components are needed. One possible approach to manufacturing graded-index waveguide components is their embedding in thin glass sheets by thermal diffusion processes. In this work, two approaches for the realization of higher order optical MMI-based splitters are compared with respect to excess and insertion loss, total geometric dimensions and the resulting constraints for the manufacturing process.
{"title":"A comparison of higher-order graded-index MMI-based splitters in thin glass sheets for PCB integration","authors":"Jan-Philipp Roth, Thomas Kühler, E. Griese","doi":"10.1109/SAPIW.2018.8401661","DOIUrl":"https://doi.org/10.1109/SAPIW.2018.8401661","url":null,"abstract":"Integrated optical interconnect systems are getting higher attention due to continuously increasing data rates in computer systems. For the realization of these systems, optical waveguide components are needed. One possible approach to manufacturing graded-index waveguide components is their embedding in thin glass sheets by thermal diffusion processes. In this work, two approaches for the realization of higher order optical MMI-based splitters are compared with respect to excess and insertion loss, total geometric dimensions and the resulting constraints for the manufacturing process.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"217 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130376498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-05-22DOI: 10.1109/SAPIW.2018.8401664
A. Zanco, S. Grivet-Talocia, T. Bradde, M. De Stefano
We present a general framework for the construction of guaranteed stable and passive multivariate macromodels from sampled frequency responses. The obtained macromodels embed in closed form the dependence on external parameters, through a data-driven approximation of input data samples based on orthogonal polynomial bases. The key novel contribution of this work is an extension to the multivariate and possibly high-dimensional case of Hamiltonian-based passivity check and enforcement algorithms, which can be applied to enforce both uniform stability and uniform passivity of the models. The modeling flow is demonstrated on a representative interconnect example.
{"title":"Multivariate macromodeling with stability and passivity constraints","authors":"A. Zanco, S. Grivet-Talocia, T. Bradde, M. De Stefano","doi":"10.1109/SAPIW.2018.8401664","DOIUrl":"https://doi.org/10.1109/SAPIW.2018.8401664","url":null,"abstract":"We present a general framework for the construction of guaranteed stable and passive multivariate macromodels from sampled frequency responses. The obtained macromodels embed in closed form the dependence on external parameters, through a data-driven approximation of input data samples based on orthogonal polynomial bases. The key novel contribution of this work is an extension to the multivariate and possibly high-dimensional case of Hamiltonian-based passivity check and enforcement algorithms, which can be applied to enforce both uniform stability and uniform passivity of the models. The modeling flow is demonstrated on a representative interconnect example.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"200 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132207635","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-05-22DOI: 10.1109/SAPIW.2018.8401658
Aurora Sanna, Giovanni Graziosi
A key aspect of power integrity in modern electronic systems is the choice and optimization of decoupling capacitors. Traditionally, this issue has been addressed at PCB level, but the integration of discrete SMD capacitors inside BGA package substrates is becoming more and more common in complex high-speed digital devices. In the context of semiconductors industry, the on-package decoupling applied to digital microcontrollers needs to be defined, often without any clear information on system configuration. This paper shows how the package behavior can change depending on the interaction with PCB parameters, and proposes a methodology to optimize on-package decoupling taking into account the system variability.
{"title":"Optimization of on-package decoupling capacitors considering system variables","authors":"Aurora Sanna, Giovanni Graziosi","doi":"10.1109/SAPIW.2018.8401658","DOIUrl":"https://doi.org/10.1109/SAPIW.2018.8401658","url":null,"abstract":"A key aspect of power integrity in modern electronic systems is the choice and optimization of decoupling capacitors. Traditionally, this issue has been addressed at PCB level, but the integration of discrete SMD capacitors inside BGA package substrates is becoming more and more common in complex high-speed digital devices. In the context of semiconductors industry, the on-package decoupling applied to digital microcontrollers needs to be defined, often without any clear information on system configuration. This paper shows how the package behavior can change depending on the interaction with PCB parameters, and proposes a methodology to optimize on-package decoupling taking into account the system variability.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"26 10","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113968284","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-05-22DOI: 10.1109/SAPIW.2018.8401659
I. E. Masri, T. Le Gouguec, P. Martin, R. Allanic, C. Quendo
This paper presents an implementation of the transmission channel for tireless interconnect Network-on-Chip (WiNoC) applications in the context of BBC (on-chip wireless Broadcast-Based parallel Computing) project. First, the advantages of the WiNoC for intra-chip communications and particularly our application are presented. Then, the intra-chip transmission is discussed and analyzed using integrated dipole antennas in Ka band (26–40 GHz). The simulations are compared to the measurements on two manufactured demonstrators. They show a good agreement and validate the problems encountered due to the Silicon substrate and its environment. Finally, we propose perspective solutions in order to improve the intra-chip transmission on integrated circuits.
{"title":"Integrated dipole antennas and propagation channel on silicon in Ka band for WiNoC applications","authors":"I. E. Masri, T. Le Gouguec, P. Martin, R. Allanic, C. Quendo","doi":"10.1109/SAPIW.2018.8401659","DOIUrl":"https://doi.org/10.1109/SAPIW.2018.8401659","url":null,"abstract":"This paper presents an implementation of the transmission channel for tireless interconnect Network-on-Chip (WiNoC) applications in the context of BBC (on-chip wireless Broadcast-Based parallel Computing) project. First, the advantages of the WiNoC for intra-chip communications and particularly our application are presented. Then, the intra-chip transmission is discussed and analyzed using integrated dipole antennas in Ka band (26–40 GHz). The simulations are compared to the measurements on two manufactured demonstrators. They show a good agreement and validate the problems encountered due to the Silicon substrate and its environment. Finally, we propose perspective solutions in order to improve the intra-chip transmission on integrated circuits.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124519955","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-05-22DOI: 10.1109/SAPIW.2018.8401665
T. Wendt, Torsten Reuschel, C. Schuster
This paper presents a method to derive an equalizer target function for a given interconnect and data rate. This is achieved by requiring a raised cosine pulse spectrum at the receiver. A technique to estimate the raised cosine pulse roll-off factor β at the receiver is presented. The target transfer function is used to directly calculate the parameters of Feed Forward Equalizer (FFE) and Continuous Time Linear Equalizer (CTLE) for the interconnect. The proposed method avoids optimization and can be completely implemented in frequency domain. The achieved vertical eye opening shows good agreement with an iterative approach for up to 7 taps and adequate agreement up to 10 taps.
{"title":"Direct prediction of linear equalization coefficients using raised cosine pulse shaping in frequency domain","authors":"T. Wendt, Torsten Reuschel, C. Schuster","doi":"10.1109/SAPIW.2018.8401665","DOIUrl":"https://doi.org/10.1109/SAPIW.2018.8401665","url":null,"abstract":"This paper presents a method to derive an equalizer target function for a given interconnect and data rate. This is achieved by requiring a raised cosine pulse spectrum at the receiver. A technique to estimate the raised cosine pulse roll-off factor β at the receiver is presented. The target transfer function is used to directly calculate the parameters of Feed Forward Equalizer (FFE) and Continuous Time Linear Equalizer (CTLE) for the interconnect. The proposed method avoids optimization and can be completely implemented in frequency domain. The achieved vertical eye opening shows good agreement with an iterative approach for up to 7 taps and adequate agreement up to 10 taps.","PeriodicalId":423850,"journal":{"name":"2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124799586","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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