Fabrication of TFTs using plasma CVD poly-Si at very low temperature

M. Mohri, H. Kakinuma, T. Tsuruoka
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引用次数: 3

Abstract

Polycrystalline-Si (poly-Si) films prepared by conventional plasma CVD with SiF/sub 4//SiH/sub 4//H/sub 2/ gases at a very low temperature (300 degrees C) have been applied to thin film transistors (TFTs). The thickness dependance of crystallinity and the surface morphology are characterized. Top gate coplanar TFT have been fabricated with optimized poly-Si. The characteristics are improved by annealing (400 degrees C). It increased the field effect mobility ( mu /sub e/) to 10.1 cm/sup 2//Vs and reduced off current (I/sub off/) by more than one order of magnitude.<>
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低温等离子体CVD多晶硅制备tft
用SiF/sub 4//SiH/sub 4//H/sub 2/气体在极低温度(300℃)下制备的多晶硅(poly-Si)薄膜已经应用于薄膜晶体管(TFTs)中。对结晶度和表面形貌的厚度依赖性进行了表征。采用优化后的多晶硅材料制备了顶栅共面TFT。退火(400℃)改善了特性,使场效应迁移率(mu /sub - e/)提高到10.1 cm/sup 2//Vs,并将关断电流(I/sub - off/)降低了一个数量级以上。
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