Strain imaging in thermoelectric devices by laser probe shearography

S. Jorez, S. Dilhaire, L. P. Lopez, S. Granby, W. Claeys, K. Uemura, J. Stockholm
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引用次数: 1

Abstract

We have developed an original optical set-up and method for the measurement of strain in electronic components. We have applied it for the study of thermoelectric devices. The method is based on speckle interferometry imaging called shearography. Two images of a same object lighted by coherent laser light are recorded upon a CCD camera through an appropriate optical system. The two images are slightly shifted one with respect to the other. This allows determining the gradient of normal surface displacement in the direction of the shift. Information taken in this manner in several directions allows to derive a map of a parameter related to the surface displacement gradients that we call "fragility factor".
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热电器件的激光探针剪切应变成像
我们开发了一种原始的光学装置和方法来测量电子元件中的应变。我们已将其应用于热电器件的研究。该方法是基于散斑干涉成像称为剪切成像。在相干激光照射下,同一物体的两幅图像通过适当的光学系统记录在CCD相机上。这两幅图像相对于另一幅有轻微的位移。这允许在位移方向上确定法向表面位移的梯度。以这种方式在几个方向上获取的信息可以得出一个与地表位移梯度有关的参数图,我们称之为“脆弱因素”。
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