Evaluation of the temperature influence on SEU vulnerability of DICE and 6T-SRAM cells

Emna Farjallah, V. Gherman, J. Armani, L. Dilillo
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引用次数: 6

Abstract

In this paper, we evaluate the temperature influence on the vulnerability to single event upsets (SEU) of 6-transistor static random access memory (6T-SRAM) cells and dual interlocked storage cells (DICE). The critical charge (Qcrit, minimum charge capable of generating an SEU) is evaluated for 65nm, 45nm, 32nm and 22nm bulk CMOS technologies and temperatures between −50°C and 150°C. A double exponential signal is used to model the current pulse generated by ionizing particles. SPICE simulations have shown that Qcrit is sensibly reduced by the rise of temperature. Qcrit variations of up to 88.4% and 99.9% have been calculated for 6T-SRAM and DICE cells, respectively.
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温度对DICE和6T-SRAM细胞SEU易损性影响的评价
在本文中,我们评估了温度对6晶体管静态随机存取存储器(6T-SRAM)单元和双联锁存储单元(DICE)的单事件干扰(SEU)脆弱性的影响。临界电荷(Qcrit,能够产生SEU的最小电荷)在65nm, 45nm, 32nm和22nm块体CMOS技术和温度在- 50°C和150°C之间进行了评估。用双指数信号来模拟电离粒子产生的电流脉冲。SPICE模拟表明,温度升高会显著降低Qcrit。对于6T-SRAM和DICE单元,Qcrit的变化分别高达88.4%和99.9%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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