Low Power Design from Technology Challenge to Great Products

Barry Dennington
{"title":"Low Power Design from Technology Challenge to Great Products","authors":"Barry Dennington","doi":"10.1145/1165573.1165625","DOIUrl":null,"url":null,"abstract":"Each generation of semiconductor process technology enables increased levels of integration and density on a single chip, Moores Law continues to prevail and the users of portable and hand held communications and entertainment products enjoy greater functionality and features. Lifestyles and user paradigms indicate that no matter how many features are added, service providers and manufacturers think of more and users cannot wait to acquire the latest products. Features, performance, fashion and, of course, fierce competition, drive the market and thereby set the challenge for the semiconductor designer. The challenge for designers is to create systems on a single chip (SoC) to provide these features for the user and to enable service and content providers to realize new emerging market opportunities. This has been a challenge for many years but, now that nanometer process technologies form the enabling process technology, the design challenge is much greater. Nanometer design effects must be considered from the initial SoC architecture all the way through to manufacturing where design for manufacturing (DFM) effects must be overcome to enable reliable, high volume production. At the silicon level the features demanded by the users require extensive efforts to provide acceptable performance and reliability. Users of cell phones, PDAs and MP3 players will be most familiar with the need for long battery life while, to achieve this, the SoC designer worries about how to design with lower supply voltages, higher leakage currents, on chip power density and reliability. Packaging techniques which assemble multiple chips to form systems in package (SiP) also create signal integrity and power dissipation issues. At the same time designers must be able to design with EDA design tools and methodology's that are still emerging and where no standards for low power design exist today to make the task easier. This keynote will talk about the low power design techniques available to SoC designers, how they are implemented in SoCs and how they are implemented in existing and new designs. The talk will end with a view on the challenges coming up next and what needs to be done to prepare for them","PeriodicalId":119229,"journal":{"name":"ISLPED'06 Proceedings of the 2006 International Symposium on Low Power Electronics and Design","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ISLPED'06 Proceedings of the 2006 International Symposium on Low Power Electronics and Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1165573.1165625","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

Each generation of semiconductor process technology enables increased levels of integration and density on a single chip, Moores Law continues to prevail and the users of portable and hand held communications and entertainment products enjoy greater functionality and features. Lifestyles and user paradigms indicate that no matter how many features are added, service providers and manufacturers think of more and users cannot wait to acquire the latest products. Features, performance, fashion and, of course, fierce competition, drive the market and thereby set the challenge for the semiconductor designer. The challenge for designers is to create systems on a single chip (SoC) to provide these features for the user and to enable service and content providers to realize new emerging market opportunities. This has been a challenge for many years but, now that nanometer process technologies form the enabling process technology, the design challenge is much greater. Nanometer design effects must be considered from the initial SoC architecture all the way through to manufacturing where design for manufacturing (DFM) effects must be overcome to enable reliable, high volume production. At the silicon level the features demanded by the users require extensive efforts to provide acceptable performance and reliability. Users of cell phones, PDAs and MP3 players will be most familiar with the need for long battery life while, to achieve this, the SoC designer worries about how to design with lower supply voltages, higher leakage currents, on chip power density and reliability. Packaging techniques which assemble multiple chips to form systems in package (SiP) also create signal integrity and power dissipation issues. At the same time designers must be able to design with EDA design tools and methodology's that are still emerging and where no standards for low power design exist today to make the task easier. This keynote will talk about the low power design techniques available to SoC designers, how they are implemented in SoCs and how they are implemented in existing and new designs. The talk will end with a view on the challenges coming up next and what needs to be done to prepare for them
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
从技术挑战到伟大产品的低功耗设计
每一代半导体工艺技术都能提高单个芯片的集成度和密度,摩尔定律继续盛行,便携式和手持通信和娱乐产品的用户享受更大的功能和特性。生活方式和用户模式表明,无论增加多少功能,服务提供商和制造商都会考虑更多,用户迫不及待地想要获得最新的产品。特点,性能,时尚,当然,激烈的竞争,推动市场,从而设置半导体设计师的挑战。设计人员面临的挑战是在单芯片(SoC)上创建系统,为用户提供这些功能,并使服务和内容提供商能够抓住新兴市场的机会。多年来,这一直是一个挑战,但现在纳米工艺技术形成了使能的工艺技术,设计挑战要大得多。从最初的SoC架构一直到制造,必须考虑纳米设计效应,其中必须克服制造设计(DFM)效应,以实现可靠的大批量生产。在硅级,用户所要求的特性需要大量的努力来提供可接受的性能和可靠性。手机、pda和MP3播放器的用户最熟悉的是对长电池寿命的需求,而为了实现这一目标,SoC设计者担心的是如何设计出更低的电源电压、更高的漏电流、片上功率密度和可靠性。将多个芯片组装在一起形成系统内封装(SiP)的封装技术也会产生信号完整性和功耗问题。与此同时,设计人员必须能够使用EDA设计工具和方法学进行设计,这些工具和方法学仍在兴起,目前还没有低功耗设计标准来简化这项任务。本主题演讲将讨论SoC设计人员可用的低功耗设计技术,它们如何在SoC中实现以及如何在现有和新设计中实现。演讲结束时,将讨论接下来将面临的挑战,以及需要做些什么来为这些挑战做准备
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A Novel Dynamic Power Cutoff Technique (DPCT) for Active Leakage Reduction in Deep Submicron CMOS Circuits Dynamic Thermal Clock Skew Compensation using Tunable Delay Buffers Power Reduction in an H.264 Encoder Through Algorithmic and Logic Transformations An Efficient Chip-level Time Slack Allocation Algorithm for Dual-Vdd FPGA Power Reduction Energy-efficient Motion Estimation using Error-Tolerance
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1