An analysis on the properties of epoxy based die attach material and the effect to delamination and wire bondability

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) Pub Date : 2008-11-01 DOI:10.1109/IEMT.2008.5507848

H. T. Wang, Y. Poh

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引用次数: 7

Abstract

Silver filled epoxy is widely used as interconnect of chip to leadframe. This paper introduces material analysis method to study effect of epoxy glue properties to delamination and wire bondability in Dual Flat Non Leaded (DFN) package. Five epoxy glues were characterized using TMA, DMA, TGA. DSC, Moisture Absorption Test and Die Shear Test. Epoxy glues were assembled into 5 × 6 × 1mm DFN package and subjected to Moisture Sensitivity Level 3. thermal cycling and autoclave test. Material analysis result is reflected into experimental verification. CTE mismatch between epoxy glue with molding compound, chip, and leadframe is identified as the primary factor causing epoxy glue delamination. High elastic modulus 1034MPa at 260°C is preferred to resist solder reflow stress. Interfacial adhesion degradation at high temperature is another key factor; investigation revealed with chip size 2mm2 high shear strength as 1.98 kg and cohesive mode with 40% epoxy remnants able to prevent epoxy glue delamination. Result showed that at wire bond temperature of 220°C, minimum elastic modulus required for consistent wire bondability is 101MPa base on chip size of 2mm2.

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分析了环氧基模具贴合材料的性能及其对分层和焊丝粘合性能的影响

银填充环氧树脂广泛用于芯片与引线框架的互连。本文引入材料分析方法，研究了环氧胶性能对双平面无铅(DFN)封装的分层和焊丝粘合性能的影响。采用TMA、DMA、TGA对5种环氧胶进行了表征。DSC，吸湿试验和模具剪切试验。将环氧胶组装成5 × 6 × 1mm DFN封装，并进行3级湿敏测试。热循环和高压灭菌试验。材料分析结果反映到实验验证中。确定了环氧胶与成型胶、切屑、引线框的CTE不匹配是导致环氧胶分层的主要原因。260℃时弹性模量1034MPa高，抗焊料回流应力。高温下界面粘附退化是另一个关键因素;研究表明，当切屑尺寸为2mm2时，抗剪强度为1.98 kg，黏结方式为40%的环氧残留物，可防止环氧胶分层。结果表明，在焊线温度为220℃时，在芯片尺寸为2mm2的情况下，保持焊线可粘合性所需的最小弹性模量为101MPa。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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