Ablation Mechanisms of Double Nanosecond Pulses Laser Drilling

Xuejun Wang
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Abstract

Thirty nanosecond 1.064 μm laser pulses separated by 150 nanoseconds have been shown up to ten times material removal rates while minimizing redeposition and heat-affected zones. The diameter of hole entrance is approximately 450 μm and half hole taper angle is 12 degree. The internal wall of the hole is bright black, no recast layer, no microcrack, smooth and no burr. The laser bursts drilling model is put forward and instantaneous process of laser drilling is discussed.
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双纳秒脉冲激光钻孔的烧蚀机理
30纳秒的1.064 μm激光脉冲间隔150纳秒,材料去除率高达10倍,同时最大限度地减少了再沉积和热影响区。孔入口直径约为450 μm,半孔锥角为12度。孔内壁亮黑色,无重铸层,无微裂纹,光滑无毛刺。提出了激光脉冲钻孔模型,讨论了激光钻孔的瞬时过程。
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