Electrical Characteristics of 100 MeV 28Si implantation in GaAs

Y. Ali, A. Narsale, O. Sidek, A. R. Damle, B. Arora
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Abstract

Single crystal n-GaAs substrates have been implanted at room temperature with 100 MeV 28Si ions to a dose of 1times1018 ions/m2. The electrical behaviour of these samples has been investigated after implantation and annealing to 850degC by current voltage (I-V) measurements. The I-V curves show series of complex behaviours with annealing treatments. To understand this complex behaviour, Resistance measurements of these samples using I-V measurements were carried out in the temperature range 100-300 K, which indicate that the as implanted sample and samples annealed to 350degC are dominated by a variable range hoping conduction mechanism, where as for the samples annealed at 450degC and 550degC the electrical conduction is due to hopping between the neighboring defect sites. The electrical transport for the sample annealed at 650degC seems to be dominated by carriers in the extended states. At annealing temperature higher than 650degC, the I-V characteristics are insensitive to measurement temperatures which indicates that the backward diode like structure after 850degC annealing is due to the activation of Si ions and formation of n+ region at the mean ion range and the existence of defect complex p+-type conductivity immediately above that region.
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GaAs中100mev 28Si注入的电特性
以100 MeV的28Si离子在室温下注入单晶n-GaAs衬底,注入剂量为1倍1018个离子/m2。通过电流电压(I-V)测量,研究了这些样品在注入和退火至850℃后的电学行为。退火后的I-V曲线表现出一系列复杂的行为。为了理解这种复杂的行为,在100-300 K的温度范围内使用I-V测量这些样品的电阻,这表明,注入样品和退火到350℃的样品由可变范围的希望传导机制主导,而对于在450℃和550℃退火的样品,导电是由于相邻缺陷位点之间的跳变。650℃退火样品的电输运似乎主要由扩展态的载流子主导。在退火温度高于650摄氏度,电流-电压特性对测量温度850摄氏度后表明,反向二极管像结构退火是由于硅离子的激活和n +地区的形成意味着离子范围和缺陷的存在复杂的p +型电导上方区域。
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