Infrared Microscopy as Applied to Failure Analysis of P-DIP Devices

S. H. Lewis
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引用次数: 5

Abstract

Infrared microscopy is an important tool to the failure analyst, and its uses in failure mode identification are becoming more varied and numerous. Recent advances in equipment have enabled high magnification examination with very good resolution when analyzing plastic encapsulated devices from the backside of the die. This paper will discuss various anomalies observable with this technique as well as sample preparation techniques and a description of the IR equipment used.
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红外显微技术在P-DIP器件失效分析中的应用
红外显微镜是故障分析的重要工具,其在故障模式识别中的应用越来越广泛。设备的最新进展使得从模具背面分析塑料封装设备时能够以非常好的分辨率进行高倍率检查。本文将讨论用这种技术观察到的各种异常,以及样品制备技术和所使用的红外设备的描述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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