Geometrically Dependent Space Charge Modulation and Quasi-saturation Effect in Superjunction-LDMOS Device

Aakanksha Mishra, B. Kumar, Jhnanesh Somayaji, Ankur Gupta
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Abstract

Increase in the demand of smart power technologies has posed a restriction on the breakdown voltage of the laterally diffused MOS (LDMOS) transistors. Superjunction-LDMOS devices have shown to offer a low on-resistance while extending the off-state breakdown voltage by the virtue of increasing depletion area in the drift region. This makes them highly suitable in fast switching applications. While they display an outstanding OFF-state performance, these devices severely suffer from space charge modulation (SCM) leading to quasisaturation (QS) effects under high current conditions. This not only affects the operation of the device, but also degrades its safe operating area. Thus, designing such devices in order to meet the off-state requirements while mitigating SCM/QS effect is challenging. Design of a superjunction (SJ) implant in the drift region is reliant on the key process and geometrical variables such as doping, thickness, position and length of the implant, as well as, on the layout parameters like drift-doping and driftscaling. These device design parameters can be optimized individually or in combination of individual parameters in order to enhance the performance of the device. This work focuses on developing an elaborate understanding of the impact of geometrical parameters on the SCM/QS effects while proposing design guidelines aiming to mitigate these ON-state operation challenges and maximize the device performance.
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超结ldmos器件中几何相关空间电荷调制及准饱和效应
智能电源技术需求的增长对横向扩散MOS (LDMOS)晶体管的击穿电压提出了限制。超结ldmos器件已显示出提供低导通电阻,同时通过增加漂移区域的耗尽面积来延长断开状态击穿电压。这使得它们非常适合于快速开关应用。虽然它们具有出色的关闭状态性能,但在高电流条件下,这些器件严重受到空间电荷调制(SCM)导致的准饱和(QS)效应的影响。这不仅会影响设备的运行,还会降低设备的安全操作面积。因此,设计这样的器件以满足非状态要求,同时减轻SCM/QS效应是具有挑战性的。漂移区超结(SJ)植入体的设计依赖于关键工艺和几何变量,如掺杂、厚度、植入体的位置和长度,以及漂移掺杂和漂移缩放等布局参数。为了提高器件的性能,可以单独或组合优化这些器件设计参数。这项工作的重点是对几何参数对SCM/QS效应的影响进行详细的理解,同时提出旨在减轻这些on状态操作挑战并最大化器件性能的设计指南。
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