T. Nishimura, H. Tanoue, Y. Oodate, H. Mattausch, M. Miura-Mattausch
{"title":"Measurement and modeling of IC self-heating including cooling system properties","authors":"T. Nishimura, H. Tanoue, Y. Oodate, H. Mattausch, M. Miura-Mattausch","doi":"10.1109/ICMTS.2015.7106115","DOIUrl":null,"url":null,"abstract":"Heating and cooling mechanisms under actual IC-operating conditions are investigated experimentally and theoretically. For the investigation different chip packages and cooling-system approaches are studied. Comparison between experimental and theoretical studies concludes that the optimum possible package design is obtained by enhancing both the heat radiation and the air convection at the same time.","PeriodicalId":177627,"journal":{"name":"Proceedings of the 2015 International Conference on Microelectronic Test Structures","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2015 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.2015.7106115","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Heating and cooling mechanisms under actual IC-operating conditions are investigated experimentally and theoretically. For the investigation different chip packages and cooling-system approaches are studied. Comparison between experimental and theoretical studies concludes that the optimum possible package design is obtained by enhancing both the heat radiation and the air convection at the same time.
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