Laser Enhanced Direct-Print Additive Manufacturing (LE-DPAM) of mm-Wave Antenna using LTCC Dielectric Paste for High Temperature Applications

Seng Loong Yu, C. Curran, A. Polotai, E. Rojas-Nastrucci
{"title":"Laser Enhanced Direct-Print Additive Manufacturing (LE-DPAM) of mm-Wave Antenna using LTCC Dielectric Paste for High Temperature Applications","authors":"Seng Loong Yu, C. Curran, A. Polotai, E. Rojas-Nastrucci","doi":"10.1109/WAMICON57636.2023.10124902","DOIUrl":null,"url":null,"abstract":"The laser-enhanced direct print additive manufacturing (LE-DPAM) process is used to fabricate and characterize low temperature co-fired ceramic (LTCC) paste for high temperature applications. Coplanar waveguides (CPW) were used to characterize the performance of the additive manufactured LTCC substrate and the permittivity is extracted using direct S-parameters measurements up to 40 GHz. The extracted permittivity is calculated to be an average of 21.3 over 1–40 GHz. A 4 dBi mm-wave antenna is designed and fabricated to demonstrate the capability to additive manufacture LTCC materials, with resonances in the 32–34 GHz range which endured at temperatures up to 980 °C. To the authors’ best knowledge, this is the first fully additive manufactured solution for LTCC technology, where both LTCC and conductive traces were printed using a microdispensing AM process.","PeriodicalId":270624,"journal":{"name":"2023 IEEE Wireless and Microwave Technology Conference (WAMICON)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE Wireless and Microwave Technology Conference (WAMICON)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WAMICON57636.2023.10124902","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The laser-enhanced direct print additive manufacturing (LE-DPAM) process is used to fabricate and characterize low temperature co-fired ceramic (LTCC) paste for high temperature applications. Coplanar waveguides (CPW) were used to characterize the performance of the additive manufactured LTCC substrate and the permittivity is extracted using direct S-parameters measurements up to 40 GHz. The extracted permittivity is calculated to be an average of 21.3 over 1–40 GHz. A 4 dBi mm-wave antenna is designed and fabricated to demonstrate the capability to additive manufacture LTCC materials, with resonances in the 32–34 GHz range which endured at temperatures up to 980 °C. To the authors’ best knowledge, this is the first fully additive manufactured solution for LTCC technology, where both LTCC and conductive traces were printed using a microdispensing AM process.
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高温LTCC介质浆料毫米波天线激光增强直接打印增材制造(LE-DPAM
激光增强直接打印增材制造(LE-DPAM)工艺用于制造和表征高温应用的低温共烧陶瓷(LTCC)浆料。使用共面波导(CPW)表征了添加剂制造的LTCC衬底的性能,并使用高达40 GHz的直接s参数测量提取了介电常数。提取的介电常数在1-40 GHz范围内的平均值为21.3。设计并制造了一个4dbi毫米波天线,以证明增材制造LTCC材料的能力,其共振范围在32-34 GHz范围内,可承受高达980°C的温度。据作者所知,这是LTCC技术的第一个完全增材制造解决方案,其中LTCC和导电痕迹都是使用微点胶AM工艺打印的。
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