{"title":"Flexible CFD simulation model of a thin vapor chamber for mobile applications","authors":"Lauri Niittymaki, C. Biber, M. Carbone","doi":"10.1109/THERMINIC.2016.7749044","DOIUrl":null,"url":null,"abstract":"Heat loads produced by electronics in mobile devices affect the external temperature distribution, which users perceive. During the design phase of a product, these distributions have to be taken into account. Simulation provides a way to try different design approaches quickly. Vapor chambers are thin heat spreaders that offer very high spreading capabilities without adding too much thickness to a low profile device. The heat spreading makes the external temperature more uniform. To simulate a vapor chamber fully would require simulation of phase changes and rapid mass flows in a very thin volume. This kind of detailed simulation is cumbersome in a system level model. Therefore, a simpler model would be useful. A few of these exist but the goal in this work was to develop a behavioral approach which would model the vapor chamber as a single object in the system model.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC.2016.7749044","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Heat loads produced by electronics in mobile devices affect the external temperature distribution, which users perceive. During the design phase of a product, these distributions have to be taken into account. Simulation provides a way to try different design approaches quickly. Vapor chambers are thin heat spreaders that offer very high spreading capabilities without adding too much thickness to a low profile device. The heat spreading makes the external temperature more uniform. To simulate a vapor chamber fully would require simulation of phase changes and rapid mass flows in a very thin volume. This kind of detailed simulation is cumbersome in a system level model. Therefore, a simpler model would be useful. A few of these exist but the goal in this work was to develop a behavioral approach which would model the vapor chamber as a single object in the system model.