Pub Date : 2016-11-21DOI: 10.1109/THERMINIC.2016.7749076
Z. Staliulionis, M. Jabbari, J. Hattel
In contrast to high fidelity CFD codes which require higher computational effort/time, the well-known Resistor-Capacitor (RC) approach requires much lower calculation time, but also with a lower resolution of the geometrical arrangement. Therefore, for enclosures without too complex geometry in their interior, it is more efficient to use the RC method for thermal management and design of electronic compartments. Thus, the objective of this paper is to build an in-house code based on the RC approach for simulating coupled heat and mass transport into a (closed) electronic enclosure. The developed code has the capability of combining lumped components and a 1D description. Heat and mass transport is based on a FVM discretization of the heat conduction equation and Fick's second law. Simulation results are compared with corresponding experimental findings and good agreement is found. Second simulation was performed to study the response of temperature and moisture inside an enclosure exposed to the B2 STANAG climatic cyclic conditions.
{"title":"Mathematical modelling of coupled heat and mass transport into an electronic enclosure","authors":"Z. Staliulionis, M. Jabbari, J. Hattel","doi":"10.1109/THERMINIC.2016.7749076","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749076","url":null,"abstract":"In contrast to high fidelity CFD codes which require higher computational effort/time, the well-known Resistor-Capacitor (RC) approach requires much lower calculation time, but also with a lower resolution of the geometrical arrangement. Therefore, for enclosures without too complex geometry in their interior, it is more efficient to use the RC method for thermal management and design of electronic compartments. Thus, the objective of this paper is to build an in-house code based on the RC approach for simulating coupled heat and mass transport into a (closed) electronic enclosure. The developed code has the capability of combining lumped components and a 1D description. Heat and mass transport is based on a FVM discretization of the heat conduction equation and Fick's second law. Simulation results are compared with corresponding experimental findings and good agreement is found. Second simulation was performed to study the response of temperature and moisture inside an enclosure exposed to the B2 STANAG climatic cyclic conditions.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122173170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-11-18DOI: 10.1109/THERMINIC.2016.7749048
R. Bornoff, V. Hildenbrand, Sangye Lugten, G. Martin, C. Marty, A. Poppe, M. Rencz, W. Schilders, Joan Yu
There are a few bottlenecks hampering efficient design of products on different integration levels of the SSL supply chain. One major issue is that data sheet information provided about packaged LEDs is usually insufficient and inconsistent among different LED vendors. Many data such as temperature sensitivity of different light output properties are provided to a limited extent only and usually by means of plots. Also, reported light output properties are typically rated for a junction temperature of 25 °C, which is obviously much below the junction temperature expected under real operating conditions. Even if “hot lumens” measured at a junction temperature of 85 °C this is not the actual operating temperature and there is little information about how such “hot lumen” tests are performed. The gap between and reported LED test data and actual operating conditions can be bridged by proper simulation models of LEDs and their environments. Such models should be accurate, hence capable of proper prediction of LED operation but simple enough to assure fast numerical simulations. However, LED integration do not get access to detailed LED information to perform those simulation at system level, thus perform reverse engineering which is time and cost consuming. A bridge, in the form of standardization, has to be established between the semiconductor industry and the LED component integrators. In order to achieve this, the following tools have to be provided: · Generic, multi-domain model of LED chips · Compact thermal model of the LED chips `environment (including the package and module assembly) · Modeling interface towards the luminaire The goal of the project is to develop a standardized method to create multi-domain LED compact models from testing data.
{"title":"Delphi4LED — from measurements to standardized multi-domain compact models of LED: A new European R&D project for predictive and efficient multi-domain modeling and simulation of LEDs at all integration levels along the SSL supply chain","authors":"R. Bornoff, V. Hildenbrand, Sangye Lugten, G. Martin, C. Marty, A. Poppe, M. Rencz, W. Schilders, Joan Yu","doi":"10.1109/THERMINIC.2016.7749048","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749048","url":null,"abstract":"There are a few bottlenecks hampering efficient design of products on different integration levels of the SSL supply chain. One major issue is that data sheet information provided about packaged LEDs is usually insufficient and inconsistent among different LED vendors. Many data such as temperature sensitivity of different light output properties are provided to a limited extent only and usually by means of plots. Also, reported light output properties are typically rated for a junction temperature of 25 °C, which is obviously much below the junction temperature expected under real operating conditions. Even if “hot lumens” measured at a junction temperature of 85 °C this is not the actual operating temperature and there is little information about how such “hot lumen” tests are performed. The gap between and reported LED test data and actual operating conditions can be bridged by proper simulation models of LEDs and their environments. Such models should be accurate, hence capable of proper prediction of LED operation but simple enough to assure fast numerical simulations. However, LED integration do not get access to detailed LED information to perform those simulation at system level, thus perform reverse engineering which is time and cost consuming. A bridge, in the form of standardization, has to be established between the semiconductor industry and the LED component integrators. In order to achieve this, the following tools have to be provided: · Generic, multi-domain model of LED chips · Compact thermal model of the LED chips `environment (including the package and module assembly) · Modeling interface towards the luminaire The goal of the project is to develop a standardized method to create multi-domain LED compact models from testing data.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122782085","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-11-18DOI: 10.1109/THERMINIC.2016.7749055
G. Hantos, J. Hegedűs, M. Rencz, A. Poppe
Die attach degradation in power electronic devices is a common failure mode besides bond wire damage. This paper describes the chip and packaging level effects of high cycle count power cycling on novel mid-power automotive MOSFETs. The related investigation is carried out in controlled ambient conditions. The thermal transient measurements during the active temperature cycling reliability test were evaluated along with K-factor calibration to identify different failure modes. The described measurement method gives the opportunity to distinguish between electrical and thermal related structural error modes. The newly developed thermal interface used in the DUTs was found to withstand the 150 °C thermal amplitude well beyond 100,000 cycles without fatal failures. The thermal performance degradation was less than 28.5% after 70,000 cycles for the complete assembly.
{"title":"Aging tendencies of power MOSFETs — A reliability testing method combined with thermal performance monitoring","authors":"G. Hantos, J. Hegedűs, M. Rencz, A. Poppe","doi":"10.1109/THERMINIC.2016.7749055","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749055","url":null,"abstract":"Die attach degradation in power electronic devices is a common failure mode besides bond wire damage. This paper describes the chip and packaging level effects of high cycle count power cycling on novel mid-power automotive MOSFETs. The related investigation is carried out in controlled ambient conditions. The thermal transient measurements during the active temperature cycling reliability test were evaluated along with K-factor calibration to identify different failure modes. The described measurement method gives the opportunity to distinguish between electrical and thermal related structural error modes. The newly developed thermal interface used in the DUTs was found to withstand the 150 °C thermal amplitude well beyond 100,000 cycles without fatal failures. The thermal performance degradation was less than 28.5% after 70,000 cycles for the complete assembly.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129792085","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-11-18DOI: 10.1109/THERMINIC.2016.7749053
J. Hegedűs, G. Hantos, A. Poppe
Temperature dependence of solid state lighting products is often not considered. Lighting products are designed either to be too robust to fulfil the requirements under any possible environmental conditions, or fail to perform the minimal expectations due to high ambient temperature. However, temperature dependent nature of LEDs even could be a new benefit, taking it into account in the design stage. Keeping the light output values at the desired level at any ambient temperature would be a cost efficient solution. This paper shows power saving effects of a smart adaptive system using a controlled current source and describes a method to gain the controlling functions. A case study with real meteorological temperature dataset is carried out.
{"title":"Embedded multi-domain LED model for adaptive dimming of streetlighting luminaires","authors":"J. Hegedűs, G. Hantos, A. Poppe","doi":"10.1109/THERMINIC.2016.7749053","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749053","url":null,"abstract":"Temperature dependence of solid state lighting products is often not considered. Lighting products are designed either to be too robust to fulfil the requirements under any possible environmental conditions, or fail to perform the minimal expectations due to high ambient temperature. However, temperature dependent nature of LEDs even could be a new benefit, taking it into account in the design stage. Keeping the light output values at the desired level at any ambient temperature would be a cost efficient solution. This paper shows power saving effects of a smart adaptive system using a controlled current source and describes a method to gain the controlling functions. A case study with real meteorological temperature dataset is carried out.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126088612","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-11-18DOI: 10.1109/THERMINIC.2016.7749071
L. Jani, A. Poppe
Evolution of the semiconductor manufacturing allows integrating more components on a single die which further increase the complexity of the chips and introduce new design challenges. Power dissipation density has reached the limits of current cooling solutions, thus thermal-aware decisions must be taken into account during the design process. Co-simulating the logic function and thermal behaviour of the design can help to evaluate the performance of the system at various stages of the design process. Logi-thermal simulators use the switching activities of the system to predict the dissipated power and calculate the temperature distribution across the chip. The temperature dependence of certain parameters (such as delay) can also be considered during the co-simulation. This paper presents an improved method for temperature dependent signal delays compared to previous solutions. Our approach is based on mixed abstraction level logic simulation, which reduce the simulation time while the temperature distribution and the calculated delays remain accurate.
{"title":"Improved method for logi-thermal simulation with temperature dependent signal delay","authors":"L. Jani, A. Poppe","doi":"10.1109/THERMINIC.2016.7749071","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749071","url":null,"abstract":"Evolution of the semiconductor manufacturing allows integrating more components on a single die which further increase the complexity of the chips and introduce new design challenges. Power dissipation density has reached the limits of current cooling solutions, thus thermal-aware decisions must be taken into account during the design process. Co-simulating the logic function and thermal behaviour of the design can help to evaluate the performance of the system at various stages of the design process. Logi-thermal simulators use the switching activities of the system to predict the dissipated power and calculate the temperature distribution across the chip. The temperature dependence of certain parameters (such as delay) can also be considered during the co-simulation. This paper presents an improved method for temperature dependent signal delays compared to previous solutions. Our approach is based on mixed abstraction level logic simulation, which reduce the simulation time while the temperature distribution and the calculated delays remain accurate.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126399712","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-11-09DOI: 10.1109/THERMINIC.2016.7749044
Lauri Niittymaki, C. Biber, M. Carbone
Heat loads produced by electronics in mobile devices affect the external temperature distribution, which users perceive. During the design phase of a product, these distributions have to be taken into account. Simulation provides a way to try different design approaches quickly. Vapor chambers are thin heat spreaders that offer very high spreading capabilities without adding too much thickness to a low profile device. The heat spreading makes the external temperature more uniform. To simulate a vapor chamber fully would require simulation of phase changes and rapid mass flows in a very thin volume. This kind of detailed simulation is cumbersome in a system level model. Therefore, a simpler model would be useful. A few of these exist but the goal in this work was to develop a behavioral approach which would model the vapor chamber as a single object in the system model.
{"title":"Flexible CFD simulation model of a thin vapor chamber for mobile applications","authors":"Lauri Niittymaki, C. Biber, M. Carbone","doi":"10.1109/THERMINIC.2016.7749044","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749044","url":null,"abstract":"Heat loads produced by electronics in mobile devices affect the external temperature distribution, which users perceive. During the design phase of a product, these distributions have to be taken into account. Simulation provides a way to try different design approaches quickly. Vapor chambers are thin heat spreaders that offer very high spreading capabilities without adding too much thickness to a low profile device. The heat spreading makes the external temperature more uniform. To simulate a vapor chamber fully would require simulation of phase changes and rapid mass flows in a very thin volume. This kind of detailed simulation is cumbersome in a system level model. Therefore, a simpler model would be useful. A few of these exist but the goal in this work was to develop a behavioral approach which would model the vapor chamber as a single object in the system model.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-11-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125098696","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-23DOI: 10.1109/THERMINIC.2016.7748641
R. Prieto, J. Colonna, P. Coudrain, N. Chevrier, K. Assigbe, S. Chéramy, A. Farcy
Graphite-based materials have been proved to be an enhancement over copper heat spreaders when directly integrated at the silicon level. However, not only they outdo copper in terms of thermal performance, but their in-plane CTE (coefficient of thermal expansion) is much closer to that of silicon. As a result, mechanical stress due to deformation mismatches is reduced during thermal cycling. Thus, thermal interface thickness can be reduced to optimize the heat flow from the hotspot. Heat management of 3D structures implies several challenges. The silicon die and intertier thickness are limited by the vertical connexions height in these heterogeneous stacks. These constraints will also imply strongly thinned heat spreaders and thermal interfaces in a future intertier implementation. This work investigates the thermo-mechanical constraints of integrating a heat spreader at the die level. Copper and PGS (pyrolytic graphite sheet) heat spreaders are compared. Their deformation subjected to thermal cycling is measured experimentally via Thermo-Moiré measurements. The differences in the deformation between the silicon die, molding and the substrate are also measured.
{"title":"Thermo-mechanical assessment of copper and graphite heat spreaders for compact packages","authors":"R. Prieto, J. Colonna, P. Coudrain, N. Chevrier, K. Assigbe, S. Chéramy, A. Farcy","doi":"10.1109/THERMINIC.2016.7748641","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7748641","url":null,"abstract":"Graphite-based materials have been proved to be an enhancement over copper heat spreaders when directly integrated at the silicon level. However, not only they outdo copper in terms of thermal performance, but their in-plane CTE (coefficient of thermal expansion) is much closer to that of silicon. As a result, mechanical stress due to deformation mismatches is reduced during thermal cycling. Thus, thermal interface thickness can be reduced to optimize the heat flow from the hotspot. Heat management of 3D structures implies several challenges. The silicon die and intertier thickness are limited by the vertical connexions height in these heterogeneous stacks. These constraints will also imply strongly thinned heat spreaders and thermal interfaces in a future intertier implementation. This work investigates the thermo-mechanical constraints of integrating a heat spreader at the die level. Copper and PGS (pyrolytic graphite sheet) heat spreaders are compared. Their deformation subjected to thermal cycling is measured experimentally via Thermo-Moiré measurements. The differences in the deformation between the silicon die, molding and the substrate are also measured.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122455019","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-22DOI: 10.1109/THERMINIC.2016.7749040
A. M. Aliyu, A. Castellazzi
This paper proposes the extraction of structure function from power devices on-board induction motor drives. It puts forward the issues and methodology related to on-board measurement of the cooling curve and derivation of the structure function during idle times in induction motor drives for maintenance purposes. The structure function uses the thermal resistances and capacitances in the Cauer form to identify changes in the device structure. The advantage of the structure function is that it does not only reveal the value but also the location of the thermal resistance and capacitance in the heat flow path. The novelty in this work is the methodology used to achieve the measurement of the cooling curve and the derivation of the structure function despite issues related to freewheeling current due to energy stored as a result of motor inductance.
{"title":"Extracting structure functions of power devices in induction motor drives","authors":"A. M. Aliyu, A. Castellazzi","doi":"10.1109/THERMINIC.2016.7749040","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749040","url":null,"abstract":"This paper proposes the extraction of structure function from power devices on-board induction motor drives. It puts forward the issues and methodology related to on-board measurement of the cooling curve and derivation of the structure function during idle times in induction motor drives for maintenance purposes. The structure function uses the thermal resistances and capacitances in the Cauer form to identify changes in the device structure. The advantage of the structure function is that it does not only reveal the value but also the location of the thermal resistance and capacitance in the heat flow path. The novelty in this work is the methodology used to achieve the measurement of the cooling curve and the derivation of the structure function despite issues related to freewheeling current due to energy stored as a result of motor inductance.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120981736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-21DOI: 10.1109/THERMINIC.2016.7749035
S. Gomés, Quanti Heat
The development of increasingly complex and nanostructured materials and devices, for example thermoelectric materials, nanocomposite polymers or micro- and nanosystems (microelectronics systems, MEMS/NEMS), requires in many cases an accurate knowledge of the thermal properties of the materials at the nanoscale. Scanning Thermal Microscopy (SThM) is a key technique for such thermal measurements with a submicrometric spatial resolution. The European project QUANTIHEAT “Quantitative scanning probe microscopy techniques for heat transfer management in nanomaterials and nanodevices” aims at solving the problems of thermal metrology at the nanoscale by delivering accurate and traceable metrology tools (nanoscale thermal terminologies, calibration samples and guidelines, modeling, novel SThM probes) for enabling the thermal management and advancing the development of new generation nanomaterials. The purpose of this article is to provide an overview of its main results after 3 years of running.
{"title":"QUANTIHEAT project: Main progresses","authors":"S. Gomés, Quanti Heat","doi":"10.1109/THERMINIC.2016.7749035","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749035","url":null,"abstract":"The development of increasingly complex and nanostructured materials and devices, for example thermoelectric materials, nanocomposite polymers or micro- and nanosystems (microelectronics systems, MEMS/NEMS), requires in many cases an accurate knowledge of the thermal properties of the materials at the nanoscale. Scanning Thermal Microscopy (SThM) is a key technique for such thermal measurements with a submicrometric spatial resolution. The European project QUANTIHEAT “Quantitative scanning probe microscopy techniques for heat transfer management in nanomaterials and nanodevices” aims at solving the problems of thermal metrology at the nanoscale by delivering accurate and traceable metrology tools (nanoscale thermal terminologies, calibration samples and guidelines, modeling, novel SThM probes) for enabling the thermal management and advancing the development of new generation nanomaterials. The purpose of this article is to provide an overview of its main results after 3 years of running.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129648399","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-01DOI: 10.1109/THERMINIC.2016.7749070
K. Lampio, R. Karvinen
A method is presented to determine the temperature field of an electronics cooling heat sink. The method is based on calculation of heat conduction in a solid numerically with the finite volume method and on solving fluid convection from analytical equations. The model is suitable for forced and natural convection heat sinks, and it uses solutions of a parallel plate channel for the friction factor and the convection Nusselt number. The validity of the method is verified by comparing its results to measured data and to CFD calculations. After verification, two practical multi-objective optimization examples are given. The first one, an industrial application, is a forced convection heat sink composed of nine heat generating components at the base plate. Then, natural convection optimization is performed on a reference array with two components. In both cases, mass is minimized, the other criterion being the maximum temperature for forced convection case, and the heat sink outer volume for natural convection case.
{"title":"Multi-objective optimization of fin array heat sinks","authors":"K. Lampio, R. Karvinen","doi":"10.1109/THERMINIC.2016.7749070","DOIUrl":"https://doi.org/10.1109/THERMINIC.2016.7749070","url":null,"abstract":"A method is presented to determine the temperature field of an electronics cooling heat sink. The method is based on calculation of heat conduction in a solid numerically with the finite volume method and on solving fluid convection from analytical equations. The model is suitable for forced and natural convection heat sinks, and it uses solutions of a parallel plate channel for the friction factor and the convection Nusselt number. The validity of the method is verified by comparing its results to measured data and to CFD calculations. After verification, two practical multi-objective optimization examples are given. The first one, an industrial application, is a forced convection heat sink composed of nine heat generating components at the base plate. Then, natural convection optimization is performed on a reference array with two components. In both cases, mass is minimized, the other criterion being the maximum temperature for forced convection case, and the heat sink outer volume for natural convection case.","PeriodicalId":143150,"journal":{"name":"2016 22nd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115242263","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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