Y. Notani, Y. Nakajima, Y. Ohta, Y. Mitsui, M. Nakayama, S. Murakami, S. Orisaka, O. Ishihara, S. Mitsui
{"title":"GaAs multi-chip power amplifier module using a multi-layer TAB tape","authors":"Y. Notani, Y. Nakajima, Y. Ohta, Y. Mitsui, M. Nakayama, S. Murakami, S. Orisaka, O. Ishihara, S. Mitsui","doi":"10.1109/GAAS.1994.636952","DOIUrl":null,"url":null,"abstract":"A novel packaging technology using a multi-layer Tape Automated Bonding (TAB) tape was developed for a GaAs multi-chip module to be employed in radio units of mobile telephones. The microwave properties of the multi-layer TAB tape were first evaluated using a ring resonator and a through-line. Then, the TAB tape was applied to a 900 MHz-band high power amplifier. It consists of two MMIC chips and an output matching circuit formed on the TAB tape. The amplifier module delivered a saturated output power of 31.6 dBm with a power added efficiency of 54.9% at 933 MHz with a supply voltage Vdd of 3.3 V. These results suggest that the TAB tape assembly has a high potentiality for realizing a thin and light weight RF unit in mobile communication terminals with low cost.","PeriodicalId":328819,"journal":{"name":"Proceedings of 1994 IEEE GaAs IC Symposium","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE GaAs IC Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAAS.1994.636952","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A novel packaging technology using a multi-layer Tape Automated Bonding (TAB) tape was developed for a GaAs multi-chip module to be employed in radio units of mobile telephones. The microwave properties of the multi-layer TAB tape were first evaluated using a ring resonator and a through-line. Then, the TAB tape was applied to a 900 MHz-band high power amplifier. It consists of two MMIC chips and an output matching circuit formed on the TAB tape. The amplifier module delivered a saturated output power of 31.6 dBm with a power added efficiency of 54.9% at 933 MHz with a supply voltage Vdd of 3.3 V. These results suggest that the TAB tape assembly has a high potentiality for realizing a thin and light weight RF unit in mobile communication terminals with low cost.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
