Quality Optimization of Resilient Applications under Temperature Constraints

Heng Yu, Y. Ha, Jing Wang
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引用次数: 7

Abstract

Inherent resilience of applications enables the design paradigm of approximate computing that exploits computation in-exactness by trading off output quality for runtime system resources. When executing such quality-scalable applications on multiprocessor embedded systems, it is expected not only to achieve the highest possible output quality, but also to handle the critical thermal challenge spurred by vastly increased chip density. While the rising temperature causes significant quality distortion at runtime, existing thermal-management techniques, such as dynamic frequency scaling, rarely take into account the trade-off possibilities between output quality and thermal budget. In this paper, we explore the application-level quality-scaling features of resilient applications to achieve effective temperature control as well as quality maximization. We propose an efficient iterative pseudo quadratic programming heuristic to decide the optimal frequency and application execution cycles, in order to achieve quality optimization, under temperature, timing, and energy constraints. Our approaches are evaluated using realistic benchmarks with known platform thermal parameters. The proposed methods show a 98.5% quality improvement with temperature violation awareness.
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温度约束下弹性应用的质量优化
应用程序固有的弹性支持近似计算的设计范例,这种设计范例通过牺牲输出质量换取运行时系统资源来利用精确计算。当在多处理器嵌入式系统上执行这种高质量可扩展的应用程序时,不仅要实现最高的输出质量,还要处理芯片密度大幅增加所带来的关键热挑战。虽然温度升高会在运行时导致严重的质量失真,但现有的热管理技术,如动态频率缩放,很少考虑输出质量和热预算之间的权衡。在本文中,我们探讨了弹性应用的应用级质量缩放特征,以实现有效的温度控制和质量最大化。我们提出了一种有效的迭代伪二次规划启发式方法来确定最优频率和应用程序执行周期,以便在温度,时间和能量约束下实现质量优化。我们的方法是使用已知平台热参数的实际基准进行评估的。采用温度违例感知的方法,质量提高98.5%。
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