Y. Hirai, Katsuo Nokamura, Yuichi Kimoto, T. Tsuchiya, O. Tabata
{"title":"Alkali Metal Dispenser Utilizing Scalloped Silicon Groove for Microfabricated Vapor Cells","authors":"Y. Hirai, Katsuo Nokamura, Yuichi Kimoto, T. Tsuchiya, O. Tabata","doi":"10.1109/FCS.2018.8597572","DOIUrl":null,"url":null,"abstract":"We propose a novel cesium (Cs) dispenser technique for filling microfabricated vapor cells with atomic Cs. The newly developed CS-dispenser composed of cesium aside (CSN3) crystal deposited on silicon (Si) grooves with multiple re-entrant structures (i.e. scalloped patterns) to enhance the thermal decomposition of Csn3. Scalloped patterns are fabricated by a sequence of isotropic and anisotropic deep reactive ion etching (DRIE). Here, the fabrication parameters are adjusted to obtain micro-size scalloped patterns. Sufficient amount of atomic Cs has been successfully observed in the microfabricated cells by a hotplate heating at about 315°C. This fabrication method enables effective thermal decomposition of Csn3 on Si substrate by low-temperature process, leading to reduce complexity of microfabricated vapor cells fabrication.","PeriodicalId":180164,"journal":{"name":"2018 IEEE International Frequency Control Symposium (IFCS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Frequency Control Symposium (IFCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/FCS.2018.8597572","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We propose a novel cesium (Cs) dispenser technique for filling microfabricated vapor cells with atomic Cs. The newly developed CS-dispenser composed of cesium aside (CSN3) crystal deposited on silicon (Si) grooves with multiple re-entrant structures (i.e. scalloped patterns) to enhance the thermal decomposition of Csn3. Scalloped patterns are fabricated by a sequence of isotropic and anisotropic deep reactive ion etching (DRIE). Here, the fabrication parameters are adjusted to obtain micro-size scalloped patterns. Sufficient amount of atomic Cs has been successfully observed in the microfabricated cells by a hotplate heating at about 315°C. This fabrication method enables effective thermal decomposition of Csn3 on Si substrate by low-temperature process, leading to reduce complexity of microfabricated vapor cells fabrication.