Compact modeling of data center raised-floor-plenum stanchions: Pressure drop through sparse tube bundles

J. Vangilder, Zachary M. Pardey, P. Bemis, David W. Plamondon
{"title":"Compact modeling of data center raised-floor-plenum stanchions: Pressure drop through sparse tube bundles","authors":"J. Vangilder, Zachary M. Pardey, P. Bemis, David W. Plamondon","doi":"10.1109/ITHERM.2016.7517678","DOIUrl":null,"url":null,"abstract":"The small-diameter stanchions which support the raised-floor system are often neglected in CFD models. However, recent studies suggest that tile airflow predictions are substantially improved when stanchions are included. Further, it is anecdotally observed that the additional flow resistance imparted by the stanchions actually improves convergence of CFD simulations. While it is possible to model the stanchions explicitly, a compact-3D-distributed-resistance approach adds negligible computational overhead and is easy to specify in CFD tools. This paper recommends 3D distributed-resistance loss coefficient values to be used directly by data center modelers. Our primary approach is based on an interpolation between published loss coefficients for densely-packed tube bundles and a sparsely-packed model which we propose here. The model is validated by explicit CFD-wind-tunnel analyses, the results of which agree well with the interpolation model. Finally, we validate the model against tile airflow measurements taken in an actual data center.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2016.7517678","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

Abstract

The small-diameter stanchions which support the raised-floor system are often neglected in CFD models. However, recent studies suggest that tile airflow predictions are substantially improved when stanchions are included. Further, it is anecdotally observed that the additional flow resistance imparted by the stanchions actually improves convergence of CFD simulations. While it is possible to model the stanchions explicitly, a compact-3D-distributed-resistance approach adds negligible computational overhead and is easy to specify in CFD tools. This paper recommends 3D distributed-resistance loss coefficient values to be used directly by data center modelers. Our primary approach is based on an interpolation between published loss coefficients for densely-packed tube bundles and a sparsely-packed model which we propose here. The model is validated by explicit CFD-wind-tunnel analyses, the results of which agree well with the interpolation model. Finally, we validate the model against tile airflow measurements taken in an actual data center.
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数据中心高架空室支柱的紧凑建模:通过稀疏管束的压降
在CFD模型中,支撑活动楼板系统的小直径支柱往往被忽略。然而,最近的研究表明,当包括支柱时,瓷砖气流预测大大改善。此外,人们还观察到,支柱带来的额外流动阻力实际上提高了CFD模拟的收敛性。虽然可以明确地对支柱进行建模,但紧凑的3d分布阻力方法增加的计算开销可以忽略不计,并且易于在CFD工具中指定。本文建议数据中心建模人员直接使用三维分布电阻损耗系数值。我们的主要方法是基于已公布的密集填充管束的损失系数和我们在这里提出的稀疏填充模型之间的插值。通过显式cfd风洞分析对模型进行了验证,结果与插值模型吻合较好。最后,我们根据实际数据中心的气流测量值验证模型。
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