Research in the Simulation Model of IGBT Package

Peng Zhang, Ronggang Han, Rui Jin, K. Yu, Jun Liu, H. Bao, Yu Zhang, J. Che
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Abstract

Simulation technology provides a powerful tool for the IGBT module design. The IGBT chip model and the interconnect parasitics are the most important factors for the package design of IGBT module. By the aid of the simulation software, the IGBT chip model is fulfilled and the package parasitics is extracted. So the whole simulation deign platform of IGBT package achieves.
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IGBT封装仿真模型的研究
仿真技术为IGBT模块的设计提供了有力的工具。IGBT芯片模型和互连寄生是IGBT模块封装设计中最重要的因素。借助仿真软件,实现了IGBT芯片模型,提取了封装寄生。从而实现了IGBT封装的整个仿真设计平台。
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