Investigation of micro porosity sintered wick in vapor chamber for fan less design

C. Yu, W. Wei, S.W. Kang
{"title":"Investigation of micro porosity sintered wick in vapor chamber for fan less design","authors":"C. Yu, W. Wei, S.W. Kang","doi":"10.1109/THERMINIC.2007.4451753","DOIUrl":null,"url":null,"abstract":"Micro Porosity Sintered wick is made from metal injection molding processes, which provides a wick density with micro scale. It can keep more than 53% working fluid inside the wick structure, and presents good pumping ability on working fluid transmission by fine infiltrated effect. Capillary pumping ability is the important factor in heat pipe design, and those general applications on wick structure are manufactured with groove type or screen type. Gravity affects capillary of these two types more than a sintered wick structure does, and mass heat transfer through vaporized working fluid determines the thermal performance of a vapor chamber. First of all, high density of porous wick supports high transmission ability of working fluid. The wick porosity is sintered in micro scale, which limits the bubble size while working fluid vaporizing on vapor section. Maximum heat transfer capacity increases dramatically as thermal resistance of wick decreases. This study on permeability design of wick structure is 0.5-0.7, especially permeability (R)=0.5 can have the best performance, and its heat conductivity is 20 times to a heat pipe with diameter (Phi)=10 mm. Test data of this vapor chamber shows thermal performance increases over 33 %.","PeriodicalId":264943,"journal":{"name":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2007-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC.2007.4451753","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Micro Porosity Sintered wick is made from metal injection molding processes, which provides a wick density with micro scale. It can keep more than 53% working fluid inside the wick structure, and presents good pumping ability on working fluid transmission by fine infiltrated effect. Capillary pumping ability is the important factor in heat pipe design, and those general applications on wick structure are manufactured with groove type or screen type. Gravity affects capillary of these two types more than a sintered wick structure does, and mass heat transfer through vaporized working fluid determines the thermal performance of a vapor chamber. First of all, high density of porous wick supports high transmission ability of working fluid. The wick porosity is sintered in micro scale, which limits the bubble size while working fluid vaporizing on vapor section. Maximum heat transfer capacity increases dramatically as thermal resistance of wick decreases. This study on permeability design of wick structure is 0.5-0.7, especially permeability (R)=0.5 can have the best performance, and its heat conductivity is 20 times to a heat pipe with diameter (Phi)=10 mm. Test data of this vapor chamber shows thermal performance increases over 33 %.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
无风机设计中蒸汽室微孔烧结芯的研究
微孔烧结灯芯由金属注射成型工艺制成,提供了微尺度的灯芯密度。它能将53%以上的工作流体保留在芯内,并通过良好的渗透作用对工作流体的输送具有良好的泵送能力。毛细泵送能力是热管设计的重要因素,一般应用于热管芯结构的热管采用槽型或筛网型制造。重力比烧结芯结构对这两种毛细管的影响更大,通过汽化工作流体的质量传热决定了蒸汽室的热性能。首先,高密度的多孔芯支撑了工作流体的高传输能力。灯芯孔隙度烧结在微观尺度上,限制了工作流体在蒸汽段汽化时的气泡大小。随着灯芯热阻的减小,最大换热能力显著增加。本研究设计的导气性为0.5-0.7的芯芯结构,特别是导气性(R)=0.5时能具有最佳性能,其导热系数是直径(Phi)=10 mm的热管的20倍。测试数据表明,该蒸汽室的热性能提高了33%以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Evaluation technique for the failure life scatter of lead-free solder joints in electronic device Vibration combined high Temperature Cycle Tests for capacitive MEMS accelerometers New reliability assessment method for solder joints in BGA package by considering the interaction between design factors Development of a prototype thermal management solution for 3-D stacked chip electronics by interleaved solid spreaders and synthetic jets Influence of transparent surface layer on effective thermoreflectance coefficient of typical stacked electronic structures
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1