{"title":"Design and fabrication of a magnetic, thin film, integrated circuit memory","authors":"T. Matcovich, W. Flannery","doi":"10.1145/1463891.1464005","DOIUrl":null,"url":null,"abstract":"Techniques have recently been developed for using uncased integrated circuits in electronic systems. The use of uncased integrated circuits in computers will lead to the development of more reliable, more economical, and physically smaller computers than can be fabricated from discrete components or packaged integrated circuits. Before these advantages can be realized, practical techniques must be developed in the following areas:\n 1. Memory design\n 2. Logic design\n 3. Chip testing\n 4. Chip bonding\n 5. Chip passivation","PeriodicalId":143723,"journal":{"name":"AFIPS '65 (Fall, part I)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1965-11-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"AFIPS '65 (Fall, part I)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1463891.1464005","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Techniques have recently been developed for using uncased integrated circuits in electronic systems. The use of uncased integrated circuits in computers will lead to the development of more reliable, more economical, and physically smaller computers than can be fabricated from discrete components or packaged integrated circuits. Before these advantages can be realized, practical techniques must be developed in the following areas:
1. Memory design
2. Logic design
3. Chip testing
4. Chip bonding
5. Chip passivation