Design and fabrication of a magnetic, thin film, integrated circuit memory

T. Matcovich, W. Flannery
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引用次数: 3

Abstract

Techniques have recently been developed for using uncased integrated circuits in electronic systems. The use of uncased integrated circuits in computers will lead to the development of more reliable, more economical, and physically smaller computers than can be fabricated from discrete components or packaged integrated circuits. Before these advantages can be realized, practical techniques must be developed in the following areas: 1. Memory design 2. Logic design 3. Chip testing 4. Chip bonding 5. Chip passivation
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磁性薄膜集成电路存储器的设计与制造
在电子系统中使用非外壳集成电路的技术最近得到了发展。在计算机中使用非外壳集成电路将导致开发出比分立元件或封装集成电路制造的更可靠、更经济、体积更小的计算机。在实现这些优势之前,必须在以下方面开发实用技术:内存设计逻辑设计芯片测试芯片粘接芯片钝化
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