Effect of Radiation & HEI on Flicker noise in 0.5 μm CMOS transistor

A. Sarje, M. Peckerar
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Abstract

The ubiquitous flicker or 1/f noise deteriorates low-frequency (LF) signals. For high reliability in CMOS devices, factors leading to degradation of SNR in LF domain need to be understood and minimized, especially for devices processing low-frequency signals. With transistors scaling down, power consumption decreasing and advancement in system integration, portable integrated CMOS sensors are being used in labs, hospitals, space applications etc. In such field applications, continuous radiation exposure degrades the sensors as well as deteriorates the signal to noise ratio. Also, in certain applications, continuous operation of sensors with high voltage stress on transistors causes hot electron injection (HEI) which also deteriorates the SNR by increasing the trap density in the gate oxide and making the sensor unreliable over time. To address the issue of SNR deterioration and to understand the reliability aspects of the sensors due to such operational stresses, we present a study of the impact of γ$\textbf{radiation exposure and hot electron injection on flicker noise of CMOS transistors. While flicker noise has been characterized in other processes, we chose the commonly available, low cost 0.5 um CMOS process for our study.
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辐射和HEI对0.5 μm CMOS晶体管闪烁噪声的影响
无处不在的闪烁或1/f噪声使低频(LF)信号恶化。为了提高CMOS器件的可靠性,需要了解并最小化导致低频域信噪比下降的因素,特别是对于处理低频信号的器件。随着晶体管的缩小、功耗的降低和系统集成的进步,便携式集成CMOS传感器正在实验室、医院、空间应用等领域得到应用。在这样的现场应用中,持续的辐射暴露会降低传感器的性能,也会降低信噪比。此外,在某些应用中,在晶体管上具有高电压应力的传感器的连续操作会导致热电子注入(HEI),这也会通过增加栅极氧化物中的陷阱密度而恶化信噪比,并使传感器随着时间的推移而不可靠。为了解决信噪比下降的问题,并了解由于这种工作应力导致传感器可靠性方面的问题,我们研究了γ辐射暴露和热电子注入对CMOS晶体管闪烁噪声的影响。虽然闪烁噪声在其他工艺中也有表征,但我们选择了常用的低成本0.5 um CMOS工艺进行研究。
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