Heterodimensional MESFETs for ultra low power electronics

T. Ytterdal, M. Shur, W. Peatman, M. Hurt
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引用次数: 1

Abstract

Revolutionary change in electronics technology will be required to meet the pressing need to dramatically reduce the power consumption of large scale integrated circuits in future low power applications such as wireless communications and other portable electronics. Our approach for realizing such change is to utilize novel two-dimensional metal-semiconductor field effect transistors (2-D MESFETs), which not only can be scaled to deep sub-micron dimensions without suffering severe narrow channel and short channel effects, but also offer new ways to implement basic logic functions using far fewer transistors than are currently required. In addition to lower power consumption and greater functionality, these new architectures should dramatically simplify the design process and allow much denser packing. In this paper we present the heterodimensional technology in general and in particular the 2D MESFET which is one of the devices based on this technology. Furthermore, we explore the advantages of utilizing this device in an integrated circuit environment.
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超低功耗电子器件的异质尺寸mesfet
在未来的低功耗应用中,如无线通信和其他便携式电子产品,需要电子技术的革命性变化来满足大幅降低大规模集成电路功耗的迫切需要。我们实现这种变化的方法是利用新型的二维金属半导体场效应晶体管(2-D mesfet),它不仅可以缩放到深亚微米尺寸而不会受到严重的窄沟道和短沟道效应的影响,而且还提供了使用比目前所需的更少的晶体管实现基本逻辑功能的新方法。除了更低的功耗和更强大的功能外,这些新架构还将大大简化设计过程,并允许更密集的封装。本文介绍了异质维技术,特别是基于该技术的一种器件——二维MESFET。此外,我们还探讨了在集成电路环境中使用该器件的优点。
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