T. Bieniek, G. Janczyk, R. Dobrowolski, K. Wojciechowska, A. Malinowska, A. Panas, M. Nieprzecki, H. Kłos
{"title":"Functionalization of MEMS cantilever beams for interconnect reliability investigation: development practice","authors":"T. Bieniek, G. Janczyk, R. Dobrowolski, K. Wojciechowska, A. Malinowska, A. Panas, M. Nieprzecki, H. Kłos","doi":"10.1117/12.2244299","DOIUrl":null,"url":null,"abstract":"This paper covers research results on development of the cantilevers beams test structures for interconnects reliability and robustness investigation. Presented results include design, modelling, simulation, optimization and finally fabrication stage performed on 4 inch Si wafers using the ITE microfabrication facility. This paper also covers experimental results from the test structures characterization.","PeriodicalId":101814,"journal":{"name":"Scientific Conference on Optical and Electronic Sensors","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Scientific Conference on Optical and Electronic Sensors","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2244299","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper covers research results on development of the cantilevers beams test structures for interconnects reliability and robustness investigation. Presented results include design, modelling, simulation, optimization and finally fabrication stage performed on 4 inch Si wafers using the ITE microfabrication facility. This paper also covers experimental results from the test structures characterization.
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