High density interconnects for rapid prototyping of electronic systems

Abstract

High density interconnect technologies for advanced electronic systems are discussed. Primary focus is in the area of laser-created interconnects for quick turnaround prototyping of electronic circuits fabricated using standard very large scale integration (VLSI) process techniques. The laser restructuring of a specific application circuitry at the wafer or packaged chip level is accomplished by creating low electrical resistance links between conductors and cutting conductor lines using an integrated computer-controlled laser system. The restructuring of generic electronic circuits is an excellent technique for alternative low cost, quick turnaround with complete circuit similarity between the laser restructured prototype and the customized product for mass production.<>