Crosstalk and switching noise mechanism study in high density wire-bond FPGA device

Abstract

This paper presents the dominant contributors of mutual inductance in wirebond package thru study on the return path. The study is validated through real device measurement correlation. Based on the study, techniques to reduce crosstalk in wire-bond package will be presented which will be beneficial to the packaging world as bond wire continues to be the dominant technique to connect die to the package in low cost application.