{"title":"Simulation methods and technologies for multichip modules","authors":"H. Reichl, G. Fotheringham","doi":"10.1109/CMPEUR.1992.218419","DOIUrl":null,"url":null,"abstract":"Concepts of multi-chip modules (MCMs) are discussed and simulation methods for their design are presented. The basic requirements for MCM materials and interconnection technologies are outlined. Signal transmission behavior and thermal problems are considered. A short survey of technologies for multilayers is given.<<ETX>>","PeriodicalId":390273,"journal":{"name":"CompEuro 1992 Proceedings Computer Systems and Software Engineering","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-05-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"CompEuro 1992 Proceedings Computer Systems and Software Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CMPEUR.1992.218419","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Concepts of multi-chip modules (MCMs) are discussed and simulation methods for their design are presented. The basic requirements for MCM materials and interconnection technologies are outlined. Signal transmission behavior and thermal problems are considered. A short survey of technologies for multilayers is given.<>
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
