On-Chip Lifetime Prediction for Dependable Many-Processor SoCs Based on Data Fusion

Ghazanfar Ali, J. Pathrose, H. Kerkhoff
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引用次数: 2

Abstract

The developments in technology and complexity of many-processor Systems-on-Chips emerge at a very rapid pace as is their introduction in safety-critical applications, for instance the transport sector. The inherent decrease in dependability of these complex nanosystems must be compensated by counter measures. One promising approach is the usage of IJTAG-compatible embedded instruments in and around cores, monitoring the "health" of target processors. It has been anticipated that these instruments will be (primarily) used for reducing the cost of final testing. In case of degradation during life time, however, they can be reused and counteractions like run-time remapping can be carried out. In this paper, the on-line data of two types of embedded instruments will be used for the prognostics, a slack-delay monitor and an IDDX monitor. Their (correlated) data is being fused which enables a more accurate life-time prediction as compared to a single monitor approach. However, the computational requirements for the embedded dependability manager will increase to enable handling embedded instrument data fusion and/or multi-parameter life-time prediction
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基于数据融合的可靠多处理器soc片上寿命预测
多处理器片上系统的技术发展和复杂性以非常快的速度出现,它们在安全关键应用领域(例如运输部门)的引入也是如此。这些复杂纳米系统固有的可靠性下降必须通过对抗措施来补偿。一种有希望的方法是在核心内部和周围使用与ijtag兼容的嵌入式仪器,监视目标处理器的“健康”。预计这些仪器将(主要)用于降低最后测试的费用。但是,如果在生命周期中出现退化,则可以重用它们,并且可以执行诸如运行时重新映射之类的抵消措施。本文将利用两种嵌入式仪器的在线数据进行预测,一种是滞后监测,另一种是IDDX监测。它们的(相关)数据正在被融合,与单一监测方法相比,这使得寿命预测更加准确。然而,嵌入式可靠性管理器的计算需求将增加,以处理嵌入式仪器数据融合和/或多参数寿命预测
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