R-processor: 0.4V resilient processor with a voltage-scalable and low-overhead in-situ error detection and correction technique in 65nm CMOS

Seongjong Kim, Mingoo Seok
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引用次数: 16

Abstract

This paper presents a design approach for upgrading the resiliency of ultra-low-voltage (ULV) microprocessors through a voltage-scalable and low-overhead in-situ error detection and correction (EDAC) technique. Particular efforts are made to overcome the poor voltage scalability and area/energy/throughput overhead of the existing EDAC techniques when applied to ULV designs. The 0.4 V, 16 b microprocessor employing the proposed EDAC and dynamic frequency scaling schemes is demonstrated in 65 nm. The microprocessor can (1) automatically modulate fCLK based on error flags across static/slow variations and (2) in-situ detect and correct the errors from fast dynamic variations, virtually eliminating timing margins. At a typical process/voltage/temperature (PVT) corner, the proposed design achieves 4.9× throughput and 59% energy efficiency improvement at only 9.5% area overhead over the baseline design under the worst-case timing margin.
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R-处理器:0.4V弹性处理器,采用65纳米CMOS,具有电压可升级和低开销原位错误检测和纠正技术
本文提出了一种设计方法,通过电压可扩展和低开销的原位错误检测和纠正(EDAC)技术,提升超低电压(ULV)微处理器的弹性。在将现有的 EDAC 技术应用于超低电压设计时,要特别努力克服电压可扩展性差和面积/能耗/吞吐量开销大的问题。在 65 纳米制程中演示了采用建议的 EDAC 和动态频率缩放方案的 0.4 V、16 b 微处理器。该微处理器可(1)根据静态/慢速变化中的错误标志自动调节 fCLK,(2)现场检测和纠正快速动态变化产生的错误,几乎消除了时序裕量。在典型的工艺/电压/温度(PVT)拐角处,拟议的设计实现了 4.9 倍的吞吐量和 59% 的能效改进,而在最坏情况下的时序余量下,与基线设计相比仅有 9.5% 的面积开销。
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