{"title":"High resolution InP via holes for millimeter wave device applications","authors":"K. Hur, R. A. McTaggart, T. Kazior","doi":"10.1109/GAAS.1994.636998","DOIUrl":null,"url":null,"abstract":"A Cl/sub 2/:HBr:BCl/sub 3/:Ar-based reactive ion etch process capable of producing high resolution via holes in InP has been developed. Tapered sidewall profiles are obtained using this process as a result of controlled photoresist mask erosion at an optimized etch condition. To demonstrate feasibility of this process for millimeter wave device applications, single-doped AlInAs/GaInAs/InP HEMTs with individually grounded source finger vias have been fabricated.","PeriodicalId":328819,"journal":{"name":"Proceedings of 1994 IEEE GaAs IC Symposium","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 1994 IEEE GaAs IC Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAAS.1994.636998","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
A Cl/sub 2/:HBr:BCl/sub 3/:Ar-based reactive ion etch process capable of producing high resolution via holes in InP has been developed. Tapered sidewall profiles are obtained using this process as a result of controlled photoresist mask erosion at an optimized etch condition. To demonstrate feasibility of this process for millimeter wave device applications, single-doped AlInAs/GaInAs/InP HEMTs with individually grounded source finger vias have been fabricated.
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