WSI implemented with button board interconnection

Abstract

Development of a cheap, high yield interconnection technology is crucial to implementing WSI circuits. However, limitations in process yield and design complexity experienced with monolithic (on-wafer) interconnect have prevented WSI from being commercially feasible. Button contacts, by providing a means of interconnecting working die for WSI processors external to the wafer, fulfil the requirements of WSI at significantly lower cost than monolithic approaches. After probe test, a printed circuit board is combined with button contacts to provide a flexible method of achieving the discretionary interconnect to good die. A prototype package has been built which demonstrates the feasibility of the authors' WSI interconnect and packaging approach. The authors discuss the button board packaging approach, the electrical characteristics of their button contact interconnect along with future applications of this technology.<>