Photonic-electronic integration with polysilicon photonics in bulk CMOS

Rajeev J Ram
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引用次数: 3

Abstract

Here, I review the development of a polysilicon photonic platform that is optimized for integration with electronics fabricated on bulk silicon wafers. This platform enables large-scale monolithic integration of silicon photonics with microelectronics. A single-polysilicon deposition and lithography mask were used to simultaneously define the transistor gate, the low-loss waveguides, the depletion modulators, and the photodetectors. Several approaches to reduce optical scattering and mitigate defect state absorption are presented. Waveguide propagation loss as low as 3 dB/cm could be realized in front-end polysilicon with an end-of-line loss as low as 10 dB/cm at 1280nm. The defect state density could be enhanced to enable all-silicon, infrared photodetectors. The resulting microring resonant detectors exhibit over 20% quantum efficiency with 9.7 GHz bandwidth over a wide range of wavelengths. A complete photonic link has been demonstrated at 5 Gbps that transfers digital information from one bulk CMOS photonics chip to another.
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光电子集成与多晶硅光子体CMOS
在这里,我回顾了多晶硅光子平台的发展,该平台针对集成在大块硅片上制造的电子设备进行了优化。该平台可实现硅光子学与微电子学的大规模单片集成。采用单多晶硅沉积和光刻掩模同时定义晶体管栅极、低损耗波导、耗尽调制器和光电探测器。提出了几种减少光散射和减轻缺陷态吸收的方法。在前端多晶硅中可以实现低至3 dB/cm的波导传播损耗,在1280nm处线端损耗低至10 dB/cm。缺陷态密度可以提高,使全硅,红外光电探测器。由此产生的微环谐振探测器在宽波长范围内具有超过20%的量子效率和9.7 GHz带宽。一个完整的光子链路已经被证明在5 Gbps,传输数字信息从一个大块CMOS光子芯片到另一个。
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