Use of compliant adhesives in the large area processing of MCM-D substrates

Abstract

Large area processing of substrates results in cost and time reduction in the fabrication of MCM-D structures. The present study focuses on the adhesive attachment of alumina and silicon tiles to suitable pallets to facilitate large area thin film processing of MCM structures. Parametric numerical models of the attachment of tiles on pallet have been developed to conduct "what-if" type analyses to understand the effects of various geometry and material parameters on thermo-mechanical response. Results from this study show that the use of low modulus, highly compliant adhesives significantly lowers the out-of-plane warpage and thermomechanical stresses in the structures. A novel set of adhesives has been developed that specifically meet the other stringent requirements, in terms of required adhesion, thermal stability and reworkability, for the palletization task.