{"title":"Thermal analysis of a two-dimensional electronic board","authors":"S. C. Yao, K. Su","doi":"10.1109/ITHERM.1988.28681","DOIUrl":null,"url":null,"abstract":"A computer program has been established to evaluate the thermal performance of two-dimensional electronic boards with elements of unequal heights. Details of convective, conductive, and radiative heat transfer are considered. Experiments have been performed in a wind tunnel on a board of 70 elements arranged in 7 columns. Thermal infrared pictures at various flow conditions are taken. The computed results agree well with the experimental data. Some critical but unresolved questions regarding the heat transfer on the pins and at the back side of the board are also discussed.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.1988.28681","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
A computer program has been established to evaluate the thermal performance of two-dimensional electronic boards with elements of unequal heights. Details of convective, conductive, and radiative heat transfer are considered. Experiments have been performed in a wind tunnel on a board of 70 elements arranged in 7 columns. Thermal infrared pictures at various flow conditions are taken. The computed results agree well with the experimental data. Some critical but unresolved questions regarding the heat transfer on the pins and at the back side of the board are also discussed.<>
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