K. Hanaoka, T. Tsuboi, S. Takahashi, K. Ueda, S. Chabata
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引用次数: 1
Abstract
A novel high-performance self-bonding wire (SBWG) with better flowability at low temperature and higher bond strength at elevated temperature than the previously used self-bonding wire (SBW5) has been developed. The wire was developed by introducing new polymers and a new curing agent as self-bonding resin formulas. SBWG can reduce the thickness of the bonding layer because of its good flowability and high bond strength. SBWG shows excellent refrigerant resistance, equal to that of SBW5.<>
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