In-band spurious attenuation in LTE-class RFIC chip using a soft magnetic thin film

S. Muroga, Y. Shimada, Y. Endo, S. Tanaka, M. Yamaguchi, N. Azuma, M. Nagata, M. Murakami, K. Hori, Shin-ichiro Takahashi
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引用次数: 2

Abstract

A long term evolution (LTE)-class CMOS radio frequency integrated circuit (RFIC) receiver test element group (TEG) chip is developed in our project for the next generation cell phone handsets in order to clarify the on-chip-level noise coupling and demonstrate the noise attenuation using the soft magnetic thin film as an on-chip electromagnetic noise suppressor. The TEG chip equips a noise generator and a RF receiver block. The RF block amplifies and demodulates transmitted signals to IQ signals. A Co85Zr3Nb12 soft magnetic thin film is integrated onto the TEG chip as a noise suppressor. In this report, the noise generator is driven by a clock signal of 124.803 MHz and generates 17th harmonics of 2,165 MHz conflicts with the LTE band 1 (2,110 - 2,170 MHz). As a result, the in-band digital noise was suppressed 5-20 dB by the Co-Zr-Nb thin film as an integrated noise suppressor.
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使用软磁薄膜的lte级RFIC芯片带内杂散衰减
为了阐明片上级噪声耦合,并演示使用软磁薄膜作为片上电磁噪声抑制器的噪声衰减,本项目为下一代手机开发了一种长期演进(LTE)级CMOS射频集成电路(RFIC)接收器测试元件组(TEG)芯片。该TEG芯片配备一个噪声发生器和一个射频接收器块。射频块将传输的信号放大并解调为IQ信号。在TEG芯片上集成了Co85Zr3Nb12软磁薄膜作为噪声抑制器件。在本报告中,噪声发生器由124.803 MHz的时钟信号驱动,产生2165 MHz的17次谐波,与LTE频段1 (2110 - 2170 MHz)冲突。结果表明,作为集成噪声抑制剂的Co-Zr-Nb薄膜可抑制带内数字噪声5-20 dB。
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