3D simulation and analysis of the radiation tolerance of voltage scaled digital circuit

Rajesh Garg, S. Khatri
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引用次数: 18

Abstract

In recent times, dynamic supply voltage scaling (DVS) has been extensively employed to minimize the power and energy of VLSI systems. Also, sub-threshold circuits are becoming more popular. At the same time, the reliability of VLSI systems has become a major concern under Single Event Upsets (SEUs). SEUs are very problematic even for circuits operating at nominal voltages. With the increasing demand for low power reliable systems, it is therefore necessary to harden DVS and sub-threshold circuits efficiently. In this paper, we perform 3D simulations of radiation particle strikes in an inverter implemented using DVS and sub-threshold design. We analyze the sensitivity of the inverter to radiation particle strikes by varying the inverter size, the inverter load, the supply voltage (VDD) and the energy of the radiation particles. From these 3D simulations, we make several observations which are important to consider during radiation hardening of DVS and sub-threshold circuits. Based on these observations, we propose several guidelines for radiation hardening of DVS and sub-threshold circuit designs. These guidelines suggest that the traditional radiation hardening approaches need to be revisited for DVS and sub-threshold designs. We also propose a charge collection model for DVS circuits. Our model can accurately estimate (with an average error of 6.3%) the charge collected at the output of a gate for different supply voltages and different gate sizes for medium and high energy particle strikes. The parameters of our charge collection model can be included in SPICE model cards of transistors, to improve the accuracy of SPICE based radiation simulations for DVS circuits.
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电压标度数字电路辐射容限的三维仿真与分析
近年来,动态电源电压缩放(DVS)被广泛用于最小化VLSI系统的功率和能量。此外,亚阈值电路正变得越来越流行。与此同时,超大规模集成电路系统的可靠性已成为单事件干扰(seu)下的主要问题。即使对于在标称电压下工作的电路,seu也是非常有问题的。随着人们对低功耗可靠系统的需求不断增加,有必要对分布式交换机和亚阈值电路进行有效的加固。在本文中,我们使用分布式交换机和亚阈值设计实现了逆变器中辐射粒子撞击的三维模拟。通过改变逆变器的尺寸、逆变器的负载、电源电压(VDD)和辐射粒子的能量,分析了逆变器对辐射粒子撞击的敏感性。从这些三维模拟中,我们得出了几个在分布式交换机和亚阈值电路的辐射硬化过程中需要考虑的重要观察结果。基于这些观察结果,我们提出了几种分布式交换机和亚阈值电路设计的辐射硬化指南。这些指南表明,传统的辐射硬化方法需要重新考虑分布式交换机和亚阈值设计。我们还提出了一个分布式交换机电路的电荷收集模型。我们的模型可以准确地估计在不同电源电压和不同栅极尺寸的中高能粒子撞击下栅极输出处收集的电荷(平均误差为6.3%)。我们的电荷收集模型的参数可以包含在晶体管的SPICE模型卡中,以提高基于SPICE的分布式交换机电路辐射模拟的准确性。
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