Pub Date : 2009-10-04DOI: 10.1109/ICCD.2009.5413172
Brandon Noia, K. Chakrabarty, Yuan Xie
System-on-chip (SOC) designs comprised of a number of embedded cores are widespread in today's integrated circuits. Embedded core-based design is likely to be equally popular for three-dimensional integrated circuits (3D ICs), the manufacture of which has become feasible in recent years. 3D integration offers a number of advantages over traditional two-dimensional (2D) technologies, such as the reduction in the average interconnect length, higher performance, lower interconnect power consumption, and smaller IC footprint. Despite recent advances in 3D fabrication and design methods, no attempt has been made thus far to design a 1500-style test wrapper for an embedded core that spans multiple layers in a 3D SOC. This paper addresses wrapper optimization in 3D ICs based on through-silicon vias (TSVs) for vertical interconnects. Our objective is to minimize the scan-test time for a core under constraints on the total number of TSVs available for testing. We present two polynomial-time heuristic solutions. Simulation results are presented for embedded cores from the ITC 2002 SOC test benchmarks.
{"title":"Test-wrapper optimization for embedded cores in TSV-based three-dimensional SOCs","authors":"Brandon Noia, K. Chakrabarty, Yuan Xie","doi":"10.1109/ICCD.2009.5413172","DOIUrl":"https://doi.org/10.1109/ICCD.2009.5413172","url":null,"abstract":"System-on-chip (SOC) designs comprised of a number of embedded cores are widespread in today's integrated circuits. Embedded core-based design is likely to be equally popular for three-dimensional integrated circuits (3D ICs), the manufacture of which has become feasible in recent years. 3D integration offers a number of advantages over traditional two-dimensional (2D) technologies, such as the reduction in the average interconnect length, higher performance, lower interconnect power consumption, and smaller IC footprint. Despite recent advances in 3D fabrication and design methods, no attempt has been made thus far to design a 1500-style test wrapper for an embedded core that spans multiple layers in a 3D SOC. This paper addresses wrapper optimization in 3D ICs based on through-silicon vias (TSVs) for vertical interconnects. Our objective is to minimize the scan-test time for a core under constraints on the total number of TSVs available for testing. We present two polynomial-time heuristic solutions. Simulation results are presented for embedded cores from the ITC 2002 SOC test benchmarks.","PeriodicalId":256908,"journal":{"name":"2009 IEEE International Conference on Computer Design","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116665775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-04DOI: 10.1109/ICCD.2009.5413114
Michael J. Anderson, C. Tsen, Liang-Kai Wang, Katherine Compton, M. Schulte
The IEEE Standards Committee recently approved the IEEE 754–2008 Standard for Floating-point Arithmetic, which includes specifications for decimal floating-point (DFP) arithmetic. A growing number of DFP solutions have emerged, and developers now have many DFP design choices including arbitrary or fixed precision, binary or decimal significand encodings, 64-bit or 128-bit DFP operands, and software or hardware implementations. There is a need for accurate analysis of these solutions on representative DFP benchmarks. In this paper, we expand previous DFP benchmark and performance analysis research. We employ a DFP benchmark suite that currently supports several DFP solutions and is easily extendable. We also present performance analysis that (1) provides execution profiles for various DFP encodings and types, (2) gives the average number cycles for common DFP operations and the total number of each DFP operation in each benchmark, and (3) highlights the tradeoffs between using 64-bit and 128-bit DFP operands for both binary and decimal significand encodings. This analysis can help guide the design of future DFP hardware and software solutions.
{"title":"Performance analysis of decimal floating-point libraries and its impact on decimal hardware and software solutions","authors":"Michael J. Anderson, C. Tsen, Liang-Kai Wang, Katherine Compton, M. Schulte","doi":"10.1109/ICCD.2009.5413114","DOIUrl":"https://doi.org/10.1109/ICCD.2009.5413114","url":null,"abstract":"The IEEE Standards Committee recently approved the IEEE 754–2008 Standard for Floating-point Arithmetic, which includes specifications for decimal floating-point (DFP) arithmetic. A growing number of DFP solutions have emerged, and developers now have many DFP design choices including arbitrary or fixed precision, binary or decimal significand encodings, 64-bit or 128-bit DFP operands, and software or hardware implementations. There is a need for accurate analysis of these solutions on representative DFP benchmarks. In this paper, we expand previous DFP benchmark and performance analysis research. We employ a DFP benchmark suite that currently supports several DFP solutions and is easily extendable. We also present performance analysis that (1) provides execution profiles for various DFP encodings and types, (2) gives the average number cycles for common DFP operations and the total number of each DFP operation in each benchmark, and (3) highlights the tradeoffs between using 64-bit and 128-bit DFP operands for both binary and decimal significand encodings. This analysis can help guide the design of future DFP hardware and software solutions.","PeriodicalId":256908,"journal":{"name":"2009 IEEE International Conference on Computer Design","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117190484","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-04DOI: 10.1109/ICCD.2009.5413145
Cheng-Kok Koh, W. Wong, Yiran Chen, Hai Helen Li
There has been much work on the next generation of memory technologies such as MRAM, RRAM and PRAM. Most of these are non-volatile in nature, and compared to SRAM, they are often denser, just as fast, and have much lower energy consumption. Using 3-D stacking technology, it has been proposed that they can be used instead of SRAM in large level 2 caches prevalent in today's microprocessors. However, one of the key challenges in the use of these technologies, such as MRAM, is their higher fault probabilities arising from the larger process variation, defects in its fabrication, and the fact that the cache is much larger. This seriously affect yield. In this paper, we propose a fault resilient set associative cache architecture which we called the salvage cache. In the salvage cache, a faulty cache block is sacrificed and used to repair faults found in other blocks. We will describe in detail the architecture of the salvage cache as well as provide results of yield simulations that show that a much higher yield can be achieved viz-a-viz other fault tolerant techniques. We will also show the performance savings that arise from the use of a large next-generation L2 cache.
{"title":"The salvage cache: A fault-tolerant cache architecture for next-generation memory technologies","authors":"Cheng-Kok Koh, W. Wong, Yiran Chen, Hai Helen Li","doi":"10.1109/ICCD.2009.5413145","DOIUrl":"https://doi.org/10.1109/ICCD.2009.5413145","url":null,"abstract":"There has been much work on the next generation of memory technologies such as MRAM, RRAM and PRAM. Most of these are non-volatile in nature, and compared to SRAM, they are often denser, just as fast, and have much lower energy consumption. Using 3-D stacking technology, it has been proposed that they can be used instead of SRAM in large level 2 caches prevalent in today's microprocessors. However, one of the key challenges in the use of these technologies, such as MRAM, is their higher fault probabilities arising from the larger process variation, defects in its fabrication, and the fact that the cache is much larger. This seriously affect yield. In this paper, we propose a fault resilient set associative cache architecture which we called the salvage cache. In the salvage cache, a faulty cache block is sacrificed and used to repair faults found in other blocks. We will describe in detail the architecture of the salvage cache as well as provide results of yield simulations that show that a much higher yield can be achieved viz-a-viz other fault tolerant techniques. We will also show the performance savings that arise from the use of a large next-generation L2 cache.","PeriodicalId":256908,"journal":{"name":"2009 IEEE International Conference on Computer Design","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115560292","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-04DOI: 10.1109/ICCD.2009.5413107
Satyanand Nalam, M. Bhargava, Kyle Ringgenberg, K. Mai, B. Calhoun
A designer's intent and knowledge about the critical issues and trade-offs underlying a custom circuit design are implicit in the simulations she sets up for design creation and verification. However, this knowledge is tightly conjoined with technology-specific features and decoupled from the final schematic in traditional design flows. As a result, this knowledge is easily lost when the technology specifics change. This paper presents a Technology Agnostic Simulation Environment (TASE), which is a tool that uses simulation templates to capture the designer's knowledge and separate it from the technology-specific components of a simulation. TASE also allows the designer to form groups of related simulations and port them as a unit to a new technology. This allows an actual design schematic to remain tied to the analyses that illuminate the underlying trade-offs and design issues, unlike the case where schematics are ported alone. Giving the designer immediate access to the trade-offs, which are likely to change in new technologies, accelerates the re-design that often must accompany porting of complicated custom circuits. We demonstrate the usefulness of TASE by investigating Read and Write noise margins for a 6T SRAM in predictive technologies down to 16 nm.
{"title":"A Technology-Agnostic Simulation Environment (TASE) for iterative custom IC design across processes","authors":"Satyanand Nalam, M. Bhargava, Kyle Ringgenberg, K. Mai, B. Calhoun","doi":"10.1109/ICCD.2009.5413107","DOIUrl":"https://doi.org/10.1109/ICCD.2009.5413107","url":null,"abstract":"A designer's intent and knowledge about the critical issues and trade-offs underlying a custom circuit design are implicit in the simulations she sets up for design creation and verification. However, this knowledge is tightly conjoined with technology-specific features and decoupled from the final schematic in traditional design flows. As a result, this knowledge is easily lost when the technology specifics change. This paper presents a Technology Agnostic Simulation Environment (TASE), which is a tool that uses simulation templates to capture the designer's knowledge and separate it from the technology-specific components of a simulation. TASE also allows the designer to form groups of related simulations and port them as a unit to a new technology. This allows an actual design schematic to remain tied to the analyses that illuminate the underlying trade-offs and design issues, unlike the case where schematics are ported alone. Giving the designer immediate access to the trade-offs, which are likely to change in new technologies, accelerates the re-design that often must accompany porting of complicated custom circuits. We demonstrate the usefulness of TASE by investigating Read and Write noise margins for a 6T SRAM in predictive technologies down to 16 nm.","PeriodicalId":256908,"journal":{"name":"2009 IEEE International Conference on Computer Design","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114180877","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-04DOI: 10.1109/ICCD.2009.5413150
A. Berman, I. Keidar
In the current deep sub-micron age, interconnect reliability is a subject of major concern, and is crucial for a successful product. Coding is a widely-used method to achieve communication reliability, which can be very useful in a Network-on-Chip (NoC). A key challenge for NoC error detection is to provide a defined detection level, while minimizing the number of redundant parity bits, using small encoder and decoder circuits, and ensuring shortest path routing. We present Parity Routing (PaR), a novel method to reduce the number of redundant bits transmitted. PaR exploits NoC path diversity to reduce the number of redundant parity bits. Our analysis shows that, for example, on a 4×4 NoC with a demand of one parity bit, PaR reduces the redundant information transmitted by 75%, and the savings increase asymptotically to 100% with the size of the NoC. In addition, we show that PaR can yield power savings due to the reduced number of bit transmissions and simple decoding process. Furthermore, PaR utilizes low complexity, small-area circuits.
{"title":"Low-overhead error detection for Networks-on-Chip","authors":"A. Berman, I. Keidar","doi":"10.1109/ICCD.2009.5413150","DOIUrl":"https://doi.org/10.1109/ICCD.2009.5413150","url":null,"abstract":"In the current deep sub-micron age, interconnect reliability is a subject of major concern, and is crucial for a successful product. Coding is a widely-used method to achieve communication reliability, which can be very useful in a Network-on-Chip (NoC). A key challenge for NoC error detection is to provide a defined detection level, while minimizing the number of redundant parity bits, using small encoder and decoder circuits, and ensuring shortest path routing. We present Parity Routing (PaR), a novel method to reduce the number of redundant bits transmitted. PaR exploits NoC path diversity to reduce the number of redundant parity bits. Our analysis shows that, for example, on a 4×4 NoC with a demand of one parity bit, PaR reduces the redundant information transmitted by 75%, and the savings increase asymptotically to 100% with the size of the NoC. In addition, we show that PaR can yield power savings due to the reduced number of bit transmissions and simple decoding process. Furthermore, PaR utilizes low complexity, small-area circuits.","PeriodicalId":256908,"journal":{"name":"2009 IEEE International Conference on Computer Design","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114259753","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-04DOI: 10.1109/ICCD.2009.5413151
A. S. Arani, Xiang Hu, Wanping Zhang, Chung-Kuan Cheng, A. Engin, Xiaoming Chen, M. Popovich
Reliable design of power distribution network for stacked integrated circuits introduces new challenges i.e., substrate coupling among through silicon vias (TSVs) and tiers grid in addition to reliability issues such as electromigration and thermo-mechanical stress, compared to conventional System on Chip (SoC). In this paper a comprehensive modeling of the TSV and stacked power grid with frequency dependent parasitic is proposed. The analytical model considers the impact of the substrate coupling between the TSVs and layers grid. A frequency domain based analysis flow is introduced to incorporate frequency dependent parasitics. The design of a reliable power distribution network is formulated as an optimization problem to minimize power noise under reliability and electro-migration constraints. Experimental results demonstrate the efficacy of the problem formulation and solution technique.
{"title":"3D stacked power distribution considering substrate coupling","authors":"A. S. Arani, Xiang Hu, Wanping Zhang, Chung-Kuan Cheng, A. Engin, Xiaoming Chen, M. Popovich","doi":"10.1109/ICCD.2009.5413151","DOIUrl":"https://doi.org/10.1109/ICCD.2009.5413151","url":null,"abstract":"Reliable design of power distribution network for stacked integrated circuits introduces new challenges i.e., substrate coupling among through silicon vias (TSVs) and tiers grid in addition to reliability issues such as electromigration and thermo-mechanical stress, compared to conventional System on Chip (SoC). In this paper a comprehensive modeling of the TSV and stacked power grid with frequency dependent parasitic is proposed. The analytical model considers the impact of the substrate coupling between the TSVs and layers grid. A frequency domain based analysis flow is introduced to incorporate frequency dependent parasitics. The design of a reliable power distribution network is formulated as an optimization problem to minimize power noise under reliability and electro-migration constraints. Experimental results demonstrate the efficacy of the problem formulation and solution technique.","PeriodicalId":256908,"journal":{"name":"2009 IEEE International Conference on Computer Design","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117083793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-04DOI: 10.1109/ICCD.2009.5413134
A. H. Baba, Kee Sup Kim
A novel DFT approach is introduced that enables massively parallel testing of logic devices at both wafer and package test. Parallelism is achieved by utilizing interconnection networks that are built onto a wafer probe or a tester interface unit. The financial benefits of this method in a realistic setting are also presented.
{"title":"Framework for massively parallel testing at wafer and package test","authors":"A. H. Baba, Kee Sup Kim","doi":"10.1109/ICCD.2009.5413134","DOIUrl":"https://doi.org/10.1109/ICCD.2009.5413134","url":null,"abstract":"A novel DFT approach is introduced that enables massively parallel testing of logic devices at both wafer and package test. Parallelism is achieved by utilizing interconnection networks that are built onto a wafer probe or a tester interface unit. The financial benefits of this method in a realistic setting are also presented.","PeriodicalId":256908,"journal":{"name":"2009 IEEE International Conference on Computer Design","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124585975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-04DOI: 10.1109/ICCD.2009.5413153
Keven L. Woo, Matthew R. Guthaus
As process technologies continue to scale into the nanometer regime, devices are becoming significantly more unreliable. Many forms of unreliability manifest as transient faults and can cause intermittent random logic upsets. These logic upsets are often caused by natural radiation (neutrons and alpha particles) or on-chip noise (cross-coupling, supply drop, or flicker noise). This research improves reliability by using non-uniform redundancy. Specifically, we present a dynamic programming algorithm that considers many possible topological redundancies, yet maintains a linear run-time due to efficient pruning of suboptimal solutions. Our algorithm provides designers with a Pareto-optimal set of solutions that trade reliability for area. Compared to existing Triple Modular Redundancy (TMR), we see similar reliability with only 35% area overhead instead of 326%.
{"title":"Fault-tolerant synthesis using non-uniform redundancy","authors":"Keven L. Woo, Matthew R. Guthaus","doi":"10.1109/ICCD.2009.5413153","DOIUrl":"https://doi.org/10.1109/ICCD.2009.5413153","url":null,"abstract":"As process technologies continue to scale into the nanometer regime, devices are becoming significantly more unreliable. Many forms of unreliability manifest as transient faults and can cause intermittent random logic upsets. These logic upsets are often caused by natural radiation (neutrons and alpha particles) or on-chip noise (cross-coupling, supply drop, or flicker noise). This research improves reliability by using non-uniform redundancy. Specifically, we present a dynamic programming algorithm that considers many possible topological redundancies, yet maintains a linear run-time due to efficient pruning of suboptimal solutions. Our algorithm provides designers with a Pareto-optimal set of solutions that trade reliability for area. Compared to existing Triple Modular Redundancy (TMR), we see similar reliability with only 35% area overhead instead of 326%.","PeriodicalId":256908,"journal":{"name":"2009 IEEE International Conference on Computer Design","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126898565","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-04DOI: 10.1109/ICCD.2009.5413173
M. Dubois, H. Stratigopoulos, S. Mir
In this paper we propose a method for evaluating test measurements for complex circuits that are difficult to simulate. The evaluation aims at estimating test metrics, such as parametric test escape and yield loss, with parts per million (ppm) accuracy. To achieve this, the method combines behavioral modeling, density estimation, and regression. The method is demonstrated for a previously proposed Built-In Self-Test (BIST) technique for ΣΔ Analog-to-Digital Converters (ADC) explaining in detail the derivation of a behavioral model that captures the main nonidealities in the circuit. The estimated test metrics are further analyzed in order to uncover trends in a large device sample that explain the source of erroneous test decisions.
{"title":"Hierarchical parametric test metrics estimation: A ΣΔ converter BIST case study","authors":"M. Dubois, H. Stratigopoulos, S. Mir","doi":"10.1109/ICCD.2009.5413173","DOIUrl":"https://doi.org/10.1109/ICCD.2009.5413173","url":null,"abstract":"In this paper we propose a method for evaluating test measurements for complex circuits that are difficult to simulate. The evaluation aims at estimating test metrics, such as parametric test escape and yield loss, with parts per million (ppm) accuracy. To achieve this, the method combines behavioral modeling, density estimation, and regression. The method is demonstrated for a previously proposed Built-In Self-Test (BIST) technique for ΣΔ Analog-to-Digital Converters (ADC) explaining in detail the derivation of a behavioral model that captures the main nonidealities in the circuit. The estimated test metrics are further analyzed in order to uncover trends in a large device sample that explain the source of erroneous test decisions.","PeriodicalId":256908,"journal":{"name":"2009 IEEE International Conference on Computer Design","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130246237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-04DOI: 10.1109/ICCD.2009.5413156
J. Lee, R. Mahapatra, Praveen Bhojwani
Concurrent on-line testing (COLT) of many-core systems-on-chip (SoC) has been recently proposed by researchers in response to the growing threat of electronic wear-out to system operational lifetimes and to the increasing reliability and availability demands of safety-critical applications. Previous research in concurrent on-line testing has focused on centralized approaches to manage core testing while the system is available to execute normal user applications. However, as technology scaling allows dozens and hundreds of processing cores to be placed on a single chip, these centralized approaches are not scalable solutions. In this paper, a distributed concurrent on-line test scheduling protocol is proposed and evaluated against previously developed solutions. Our experiments show that a distributed COLT scheduler can test a moderately-sized SoC with a speedup of 3.85 over centralized approaches while consuming 84% less energy, and performance benefits improve as the number of cores per chip increases. This research also presents a core test ordering algorithm — Code-Division Core Test Scheduling — that provides an additional 40% reduction in system test latency compared to other schedulers.
{"title":"A distributed concurrent on-line test scheduling protocol for many-core NoC-based systems","authors":"J. Lee, R. Mahapatra, Praveen Bhojwani","doi":"10.1109/ICCD.2009.5413156","DOIUrl":"https://doi.org/10.1109/ICCD.2009.5413156","url":null,"abstract":"Concurrent on-line testing (COLT) of many-core systems-on-chip (SoC) has been recently proposed by researchers in response to the growing threat of electronic wear-out to system operational lifetimes and to the increasing reliability and availability demands of safety-critical applications. Previous research in concurrent on-line testing has focused on centralized approaches to manage core testing while the system is available to execute normal user applications. However, as technology scaling allows dozens and hundreds of processing cores to be placed on a single chip, these centralized approaches are not scalable solutions. In this paper, a distributed concurrent on-line test scheduling protocol is proposed and evaluated against previously developed solutions. Our experiments show that a distributed COLT scheduler can test a moderately-sized SoC with a speedup of 3.85 over centralized approaches while consuming 84% less energy, and performance benefits improve as the number of cores per chip increases. This research also presents a core test ordering algorithm — Code-Division Core Test Scheduling — that provides an additional 40% reduction in system test latency compared to other schedulers.","PeriodicalId":256908,"journal":{"name":"2009 IEEE International Conference on Computer Design","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131129329","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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