Silicon Integrated Circuits Incorporating Antennas

K. O. Kenneth, Kihong Kim, B. Floyd, J. Mehta, H. Yoon, C. Hung, D. Bravo, T. Dickson, Xiaoling Guo, Ran Li, N. Trichy, J. Caserta, W. Bomstad, J. Branch, Dong-Jun Yang, J. Bohorquez, Jie Chen, E. Seok, J. Brewer, Li Gao, A. Sugavanam, Jau-Jr Lin, Y. Su, C. Cao, M. Hwang, Yanping Ding, Zhenbiao Li, S.-H. Hwang, H. Wu, S. Sankaran, N. Zhang
{"title":"Silicon Integrated Circuits Incorporating Antennas","authors":"K. O. Kenneth, Kihong Kim, B. Floyd, J. Mehta, H. Yoon, C. Hung, D. Bravo, T. Dickson, Xiaoling Guo, Ran Li, N. Trichy, J. Caserta, W. Bomstad, J. Branch, Dong-Jun Yang, J. Bohorquez, Jie Chen, E. Seok, J. Brewer, Li Gao, A. Sugavanam, Jau-Jr Lin, Y. Su, C. Cao, M. Hwang, Yanping Ding, Zhenbiao Li, S.-H. Hwang, H. Wu, S. Sankaran, N. Zhang","doi":"10.1109/CICC.2006.320824","DOIUrl":null,"url":null,"abstract":"The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. This technology can potentially be used for intra and inter-chip interconnection, and implementation of true single chip radios, beacons, radars, RFID tags and others, as well as contact-less high frequency testing","PeriodicalId":269854,"journal":{"name":"IEEE Custom Integrated Circuits Conference 2006","volume":"78 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Custom Integrated Circuits Conference 2006","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.2006.320824","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

The feasibility of integrating antennas and required circuits to form wireless interconnects in foundry digital CMOS technologies has been demonstrated. The key challenges including the effects of metal structures associated with integrated circuits, heat removal, packaging, and interaction of transmitted and received signals with nearby circuits appear to be manageable. This technology can potentially be used for intra and inter-chip interconnection, and implementation of true single chip radios, beacons, radars, RFID tags and others, as well as contact-less high frequency testing
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集成天线的硅集成电路
在代工数字CMOS技术中集成天线和所需电路形成无线互连的可行性已经被证明。关键的挑战包括与集成电路相关的金属结构的影响、散热、封装以及收发信号与附近电路的相互作用似乎是可控的。该技术可用于芯片内部和芯片间互连,实现真正的单芯片无线电,信标,雷达,RFID标签等,以及非接触式高频测试
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